Multi-wire cutting machine mortar jet flow device
A multi-wire cutting machine and mortar technology, which is used in fine working devices, working accessories, stone processing equipment, etc., can solve the problems of uneven distribution of mortar density and flow, and achieve the effect of improving speed and quality and improving uniformity.
Inactive Publication Date: 2012-07-18
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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Problems solved by technology
[0003] The technical problem to be solved in the present invention is to propose a multi-wire cutting machine mortar spray device for the uneven distribution of mortar density and flow rate, which can greatly improve the density of mortar supply and the uniformity of flow rate, and improve the efficiency of silicon wafer cutting. speed and quality
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[0014] Such as figure 1 As shown, the mortar spray device of the multi-wire cutting machine has an outer casing 1, and an inner pipe 2 with one end as a mortar inlet and the other end closed is fixedly installed in the outer casing 1, and the outer wall of the inner pipe 2 and the inner wall of the outer casing 1 are fixed. There is an annular gap 6, and the upper part of the inner tube 2 is provided with a plurality of small circular holes 7 uniformly distributed along the axis of the inner tube, and the small circular holes 7 communicate with the lumen of the inner tube and the annular gap; the lower side of the outer tube 1 is along the axis Have the slit opening groove 8.
[0015] This device is directly connected with the mortar supply system of the cutting machine and fixed on the mortar distributor; the positioning pin 4 is a split fastening pin (standard part), used to limit the small round hole 7 of the inner tube 2 and the outer tube 1 The relative position of the s...
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The invention discloses a multi-wire cutting machined mortar jet flow device, which is used in a multi-wire cutting machine for cutting semiconductor silicon chips or solar silicon cells in batch. The outer sleeve (1) of the device is fixedly provided with an inner pipe (2) of which one end is a mortar inlet and of which the other end is closed; an annular gap (6) is reserved between the outer wall of the inner pipe (2) and the inner wall of the outer sleeve (1); the upper part of the inner pipe (2) is provided with a plurality of small round holes (7) which are uniformly distributed along the axis of the inner pipe, and the small round holes (7) are communicated with the cavity of the inner pipe and the annular gap; and the lower side of the outer sleeve (1) has a slit open slot (8) along the axis. Due to the structural characteristics of the device and the changes of the flowing direction of the mortar in the device, the flow rate and density distribution uniformity of the mortar are improved, and the cutting production efficiency of the equipment and the surface quality of the cut silicon chips are also improved.
Description
technical field [0001] The invention relates to semiconductor wafer or solar silicon cell production equipment. Background technique [0002] The multi-wire cutting machine has extremely high wafer productivity and can obtain excellent wafer surface quality. The flow rate and density distribution uniformity of the mortar supplied by the multi-wire cutting machine are the key factors affecting the output rate and quality of the sheet. Uneven density or partial cut-off without cutting fluid will cause wire breakage and scratches on the silicon wafer. Seriously reduce the pass rate of the product. Contents of the invention [0003] The technical problem to be solved in the present invention is to propose a multi-wire cutting machine mortar spray device for the uneven distribution of mortar density and flow rate, which can greatly improve the density of mortar supply and the uniformity of flow rate, and improve the efficiency of silicon wafer cutting. speed and quality. [...
Claims
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IPC IPC(8): B28D7/00B28D5/04
Inventor 刘咸成吕文利刘嘉宾贾京英龚杰洪
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP