All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method

[0038] Such as figure 1 , figure 2 , image 3 , Figure 4 As shown, figure 1 It is the working position and station distribution diagram of the main turret system and the laser marking turret system of the present invention, figure 2 Is a schematic diagram of the three-dimensional structure of the present invention, image 3 Is a schematic side view of the structure of the present invention, Figure 4 It is a schematic diagram of the station distribution of the device processing system of the present invention. Now combined figure 1 , figure 2 , image 3 , Figure 4 The embodiment of the present invention is described in detail: an integrated machine for testing, sorting, marking and taping of semiconductor devices, including a machine body 1 and various device processing systems that are fixedly connected to the machine body, and a 16 working machine is provided on the machine body 1. The main turret system 2 and a 16-station laser marking turret system 3 matched with it, the corresponding stations on the main turret system 2 and the laser marking turret system 3 Corresponding device processing systems are provided. Each work position of the main turret system 2 is provided with a suction nozzle mechanism 21 for device pick-up and delivery, and the main turret system 2 is also provided The suction nozzle pressing mechanism 22 corresponding to the suction nozzle mechanism 21 for picking, placing and conveying the device is provided with a device conveying mechanism 23 on each working position of the laser marking turret system 3.

[0039] The device processing system includes vibration self-alignment feeding system 4, visual imaging direction detection system 5, high-speed correction positioning and steering system 6, electrical performance parameter real-time detection system A7, electrical performance parameter real-time detection system B8, and laser marking system 10. Visual imaging identification detection system 12, classification selection collection system A9, classification selection collection system B11, classification selection collection system C13, classification selection collection system D14, classification selection collection system E15, classification selection collection system F16, classification selection collection system G17 , Classification, selection and collection system H18, visual imaging 3D size detection system 19 and/or tape and packaging output system 20, and also includes a control system 25, and a display and operating system 24. The control system 25 is set in the machine body 1 Below, the display and operating system 24 is arranged above the machine body 1.

[0040] Place the semiconductor devices in the vibrating disk in the vibrating self-arrangement feeding system 4 in advance, and use the vibrating motor to directionally vibrate. The semiconductor devices can be arranged in an orderly manner, and the wrong directions of the semiconductor devices can be identified and filtered. The vibrating plate port adjusts the semiconductor device to the correct direction, making the feeding more convenient, effective and timely; the supply speed can guarantee the maximum amount of 30,000 pieces/hour, and then it is filtered, and finally transported through the straight discharge track and passed the identification The direction of the semiconductor device, the semiconductor device is sent to the separator.