Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method

A processing method and semiconductor technology, applied in the direction of semiconductor/solid-state device testing/measurement, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as waste of labor, complicated operation, and failure to meet market demand, so as to improve work efficiency, The effect of guaranteeing the pass rate

Active Publication Date: 2011-03-23
深圳市复德科技有限公司
View PDF4 Cites 35 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing technology, most of the semiconductor device processing automation equipment in my country are single-program processing equipment, such as: semiconductor chip testing machine, semiconductor chip tape machine, semiconductor chip sorting machine, semiconductor chip marking machine, or semiconductor chip Sorting and marking machines, etc., the above equipment cannot realize processing automation and complex operation, low efficiency, waste of labor, unstable product quality, cannot meet market demand, and generally hinder the rapid development of the semiconductor chip industry

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method
  • All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method
  • All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0038] Such as figure 1 , figure 2 , image 3 , Figure 4 as shown, figure 1 It is the main turret system and the laser marking turret system working position and working position distribution diagram of the present invention, figure 2 It is a schematic diagram of the three-dimensional structure of the present invention, image 3 It is a side view structural schematic diagram of the present invention, Figure 4 It is a schematic diagram of station distribution of the device processing system of the present invention. Combine now figure 1 , figure 2 , image 3 , Figure 4 Describe the embodiment of the present invention in detail: a semiconductor device testing, sorting, marking and taping integrated machine, including a machine body 1 and various device processing systems that are fixedly connected with the machine body, and a 16 working system is provided on the machine body 1 The main turret system 2 of the station and the laser marking turret system 3 of a 16 w...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an all-in-one machine of a semiconductor device for testing, sorting, marking and braiding and a one-stop processing method. A scheme in the invention is as follows: the semiconductor device is transported to a device processing system arranged on each station to be processed by the all-in-one machine. The all-in-one machine comprises a machine body and each device processing system, wherein the machine body is provided with a main turret system and a laser marking turret system respectively with 16 working positions; each station of the main turret system is provided with a suction nozzle mechanism for picking, placing and transporting the device; the main turret system is also provided with a suction nozzle pressing mechanism; each station of the laser marking turret system is provided with a device transmission mechanism; and the suction nozzle mechanism and the device transmission mechanism successively transmit the semiconductor device to each device processing system to finish one-stop continuous processing. By the implementation of the invention, various functions such as testing, sorting, marking, braiding, outputting and the like which originally need to be finished by various equipment are finished on one equipment, thus saving cost and improving working efficiency.

Description

technical field [0001] The invention relates to semiconductor device processing equipment and a processing method, in particular to a semiconductor device testing, sorting, marking, and tape integration machine and a one-stop processing method. Background technique [0002] my country's LED packaging equipment manufacturing and complete line matching capabilities are far behind foreign countries. Except for a very small number of dicing machines and some auxiliary equipment that can meet the production line, the rest (such as chip bonding machines, wire welding machines, testing machines, etc.) , Taping machines, etc.) automation equipment still relies on imports. [0003] In the existing technology, most of the semiconductor device processing automation equipment in my country are single-program processing equipment, such as: semiconductor chip testing machine, semiconductor chip tape machine, semiconductor chip sorting machine, semiconductor chip marking machine, or semicon...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/00H01L21/66B65B15/04B65B9/02B65B51/10
Inventor 龙超祥刘琪珉高俊杰
Owner 深圳市复德科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com