All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method

A processing method and semiconductor technology, applied in the direction of semiconductor/solid-state device testing/measurement, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as waste of labor, complicated operation, and failure to meet market demand, so as to improve work efficiency, The effect of guaranteeing the pass rate

Active Publication Date: 2011-03-23
深圳市复德科技有限公司
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Problems solved by technology

[0003] In the existing technology, most of the semiconductor device processing automation equipment in my country are single-program processing equipment, such as: semiconductor chip testing machine, semiconductor chip tape machine, semiconductor chip sorting machine, semiconductor chip marking machin

Method used

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  • All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method
  • All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method
  • All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method

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[0038] Such as figure 1 , figure 2 , image 3 , Figure 4 As shown, figure 1 It is the working position and station distribution diagram of the main turret system and the laser marking turret system of the present invention, figure 2 Is a schematic diagram of the three-dimensional structure of the present invention, image 3 Is a schematic side view of the structure of the present invention, Figure 4 It is a schematic diagram of the station distribution of the device processing system of the present invention. Now combined figure 1 , figure 2 , image 3 , Figure 4 The embodiment of the present invention is described in detail: an integrated machine for testing, sorting, marking and taping of semiconductor devices, including a machine body 1 and various device processing systems that are fixedly connected to the machine body, and a 16 working machine is provided on the machine body 1. The main turret system 2 and a 16-station laser marking turret system 3 matched with it, ...

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Abstract

The invention discloses an all-in-one machine of a semiconductor device for testing, sorting, marking and braiding and a one-stop processing method. A scheme in the invention is as follows: the semiconductor device is transported to a device processing system arranged on each station to be processed by the all-in-one machine. The all-in-one machine comprises a machine body and each device processing system, wherein the machine body is provided with a main turret system and a laser marking turret system respectively with 16 working positions; each station of the main turret system is provided with a suction nozzle mechanism for picking, placing and transporting the device; the main turret system is also provided with a suction nozzle pressing mechanism; each station of the laser marking turret system is provided with a device transmission mechanism; and the suction nozzle mechanism and the device transmission mechanism successively transmit the semiconductor device to each device processing system to finish one-stop continuous processing. By the implementation of the invention, various functions such as testing, sorting, marking, braiding, outputting and the like which originally need to be finished by various equipment are finished on one equipment, thus saving cost and improving working efficiency.

Description

technical field [0001] The invention relates to semiconductor device processing equipment and a processing method, in particular to a semiconductor device testing, sorting, marking, and tape integration machine and a one-stop processing method. Background technique [0002] my country's LED packaging equipment manufacturing and complete line matching capabilities are far behind foreign countries. Except for a very small number of dicing machines and some auxiliary equipment that can meet the production line, the rest (such as chip bonding machines, wire welding machines, testing machines, etc.) , Taping machines, etc.) automation equipment still relies on imports. [0003] In the existing technology, most of the semiconductor device processing automation equipment in my country are single-program processing equipment, such as: semiconductor chip testing machine, semiconductor chip tape machine, semiconductor chip sorting machine, semiconductor chip marking machine, or semicon...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/66B65B15/04B65B9/02B65B51/10
Inventor 龙超祥刘琪珉高俊杰
Owner 深圳市复德科技有限公司
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