LED (light emitting diode) lighting module

Abstract

The invention relates to the field of modular LED (light emitting diode) street lamp lighting, in particular to an LED lighting module which is composed of ceramic radiating fins, a power box, a superconductive base and a light source chamber, wherein a plurality of ceramic radiating fin connecting grooves are arranged on the superconductive base with a plurality of vertically thorough heat dissipation holes, the ceramic radiating fin cavity forms into an whole through an epoxy resin heat conducting layer, and meanwhile, the power box, in which a driving power supply is arranged, is arranged on the superconductive base; and a plurality of LED wafers are arrayed on the bottom part of the superconductive base, and the LED wafers are covered by a light distribution lens to form the light source chamber. Therefore, the light source chamber and power box of the LED lighting module are separated, a radiator and a lamp cover are designed integrally, so that the radiating links are reduced, the heat conduction and heat dissipation performances are improved greatly, and the LED lighting module has the characteristics of improved luminous efficiency, prolonged service life, compact structure, low cost, and the like.

Description

technical field [0001] The invention relates to an LED lighting module, which is mainly used in high-power LED road lighting and belongs to the integrated application field of high-power LED light sources. Background technique [0002] At present, the high-power LED lighting module has the following deficiencies: (1) the substrate of multiple LED chip packages is small, the heat dissipation link is complicated, and the temperature of the substrate is slow to dissipate heat, which greatly affects the normal operation of the LED chip; (2) when the LED chip emits light, the photon Due to the large reflection loss caused by the difference in refractive index at the exit interface, the light extraction efficiency is reduced; (3) when multiple LED chips are packaged, because the bracket blocks part of the light, the angle of the LED chip when it emits light becomes smaller; (4) LED After the light source is matched with the heat sink and the lamp housing, the structure is complex,...

AI Technical Summary

Problems solved by technology

[0002] At present, the high-power LED lighting module has the following deficiencies: (1) the substrate of multiple LED chip packages is small, the heat dissipation link is complicated, and the temperature of the substrate is slow to dissipate heat, which greatly affects the normal operation of the LED chip; (2) when the LED chip emits light, the photon Due to the large reflection loss caused by the difference in refractive index at the exit interface, the light extraction efficiency is reduced; (3) when multiple LED chips are packaged, because the bracket blocks part of the light, the angle of the LED chip when it emits light becomes smaller; (4) LED After the light source is matched with the heat sink and the lamp housing, the structure is complex, the cost is high, and the effect is poor; Disadvantages such as poor light color quality

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