Unlock instant, AI-driven research and patent intelligence for your innovation.

Conveying mechanism and processing device

A technology of conveying mechanism and processing device, which is applied in the direction of conveyor objects, transportation and packaging, etc., which can solve the problem of increasing the conveying stroke, achieve the effect of shortening the conveying stroke and realizing miniaturization

Active Publication Date: 2014-08-13
DISCO CORP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, when the conveying mechanism described in the above-mentioned Patent Document 1 is applied to the processing device, the conveying arm has to be moved to the depth of the working area of ​​the workpiece, the conveying stroke increases, and the conveying mechanism is enlarged. question

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Conveying mechanism and processing device
  • Conveying mechanism and processing device
  • Conveying mechanism and processing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in the following description, although the example which applied this invention to a laser processing apparatus is demonstrated, it is not limited to this structure. The present invention can be applied to any device as long as it processes a semiconductor wafer. For example, it can be applied to a cutting device that cuts a semiconductor wafer with a cutting tool, or a grinding device that grinds a semiconductor wafer with a grinding wheel.

[0023] First, before describing the laser processing apparatus according to the embodiment of the present invention, a semiconductor wafer to be processed will be briefly described. Figure 7 It is a perspective view of a semiconductor wafer supported by a ring frame.

[0024] Such as Figure 7 As shown, the semiconductor wafer W is formed in a substantially disk shape, and the surface of the semiconductor w...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a conveying mechanism and a processing device, which are capable of shortening a conveying stroke during conveying of workpieces in a work zone between a box and workpieces, and realizing miniaturization. In a direction, namely in a direction from a receiving zone (A1) toward a work zone (A3), the conveying mechanism operates as follows: draw out a semiconductor chip (W) kept by a first clamping part (71) to a temporary placement zone (A2) from the receiving zone, and make a push-pull arm in the temporary placement zone pass by to the rear end side of the semiconductor chip, and push the semiconductor chip to the work zone via a second abutting part (75). In another direction, namely in a direction from the work zone to the receiving zone, the conveying mechanism operates as follows: draw out the semiconductor kept by a second clamping part (72) to the temporary placement zone from the work zone, make the push-pull arm in the temporary placement zone pass by to the rear end side of the semiconductor chip, and push the semiconductor chip to the receiving zone via a first abutting part (74).

Description

technical field [0001] The present invention relates to a transfer mechanism, and more particularly to a transfer mechanism and a processing device for extracting workpieces such as semiconductor wafers from a cassette and transferring them to a working area of ​​the workpiece. Background technique [0002] In the manufacturing process of semiconductor devices, grid-like partitions (segmentation lines) are formed on the surface of workpieces such as semiconductor wafers, and IC (Integrated Circuit) and LSI (Large-scale) are formed in the regions divided by the partitions. Integration: large-scale integrated circuits) and other circuits. Next, a processing device is used to cut the semiconductor wafer along the separation lanes, and divide it into individual semiconductor chips. The semiconductor chips thus divided are packaged and widely used in electrical equipment such as mobile phones and personal computers. [0003] The processing device is provided with a conveyance m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677
Inventor 增田幸容饭塚健太吕
Owner DISCO CORP