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Modified copper-based pantograph sliding material and preparation method

A pantograph sliding plate, copper-based technology, applied in the field of materials, can solve the problems of short life, poor performance reliability, etc., and achieve the effects of improving poor compatibility, improving electrical conductivity and lubricating performance, and simple process

Inactive Publication Date: 2011-04-27
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the main disadvantages of using skateboard materials are short service life and poor performance reliability. With the continuous increase of the speed of railways, higher and higher requirements are put forward for the performance of pantograph skateboard materials.

Method used

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  • Modified copper-based pantograph sliding material and preparation method
  • Modified copper-based pantograph sliding material and preparation method
  • Modified copper-based pantograph sliding material and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Each component in the plating solution is Wt(H 2 O): Wt(CuSO 4 ): Wt(C 10 h 14 N 2 Na 2 o 3 ): Wt(C 10 h 8 N 2 ): Wt(NaOH): Wt(CH 2 O)=94: 2: 0.5: 0.5: 1: 2, after plating for 0.5 hours, the volume ratio of the strengthener and modifier powder after plating to the matrix copper is V (Cu): V (Ti 2 AlC): V (BN): V (C)=65:25:8:2; Mix evenly, add appropriate amount of binder, put it into a steel mold, cold press molding, the pressure is 100MPa, under the protection of hydrogen atmosphere Carry out sintering, the heating rate is 20°C / min, the sintering temperature is 750°C, and the temperature is kept for 30 minutes. After that, the sample is taken out, placed in the mold, and the second cold pressing is carried out at a pressure of 150MPa. The second sintering is carried out under the protection of hydrogen atmosphere, and the temperature The speed is 20°C / min, the sintering temperature is 850°C, and the temperature is kept for 30 minutes. The density of the obtai...

Embodiment 2

[0043] Each component in the plating solution is Wt(H 2 O): Wt(CuSO 4 ): Wt(C 10 h 14 N 2 Na 2 o 3 ):Wt(C 10 h 8 N 2 ): Wt(NaOH): Wt(CH 2 (O)=90: 3: 1: 1: 2: 3, after plating for 1 hour, the volume ratio of the reinforcing agent and modifier powder after plating to the matrix copper is V (Cu): V (Ti 2 AlC): V (BN): V (C)=70:20:6:4; mix evenly, add an appropriate amount of binder, put it into a steel mold, cold press molding, the pressure is 100MPa, under the protection of hydrogen atmosphere Carry out sintering, the heating rate is 20°C / min, the sintering temperature is 750°C, and the temperature is kept for 30 minutes. After that, the sample is taken out, placed in the mold, and the second cold pressing is carried out at a pressure of 150MPa. The second sintering is carried out under the protection of hydrogen atmosphere, and the temperature The speed was 20°C / min, the sintering temperature was 850°C, and the heat preservation time was 30 minutes. The density of the...

Embodiment 3

[0046] Each component in the plating solution is Wt(H 2 O): Wt(CuSO 4 ): Wt(C 10 h 14 N 2 Na 2 o 3 ): Wt(C 10 h 8 N 2 ): Wt(NaOH): Wt(CH 2 O)=90: 2: 1.5: 1.5: 3: 2, plating for 1 hour, the volume ratio of the reinforced and modifier powder after plating to the matrix copper is V (Cu): V (Ti 2 AlC): V (BN): V (C)=75:15:7:3; mix evenly, add an appropriate amount of binder, put it into a steel mold, cold press molding, the pressure is 100MPa, under the protection of hydrogen atmosphere Carry out sintering, the heating rate is 20°C / min, the sintering temperature is 750°C, and the temperature is kept for 30 minutes. After that, the sample is taken out, placed in the mold, and the second cold pressing is carried out at a pressure of 150MPa. The second sintering is carried out under the protection of hydrogen atmosphere, and the temperature is raised The speed was 20°C / min, the sintering temperature was 850°C, and the heat preservation time was 30 minutes. The density of th...

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Abstract

The invention relates to a modified copper-based pantograph sliding material and a preparation method. The material contains raw materials of Cu, Ti2AlC, BN and graphite in a volume ratio of (60-95) to (1-30) to (1-10) to (1-5). The method comprises the following steps of: mixing the four raw materials and putting the mixture in a steel die; firstly carrying out cold pressing to the mixture, putting the mixture in a high-temperature furnace under the protection atmosphere of hydrogen, increasing the temperature to 700-900 DEG C, keeping the temperature for 5-30 min, taking out a sample and carrying out cold pressing; then, secondarily sintering at 800-900 DEG C and keeping the temperature for 30-60 min. The invention has simple process, is convenient to operate, can rapidly prepare the modified copper-based pantograph sliding material by utilizing traditional production equipment, and the material has the advantages of excellent performance and lower cost.

Description

technical field [0001] The invention relates to the field of materials, in particular to a novel pantograph slide material for electric locomotives and a preparation method thereof. Background technique [0002] The skateboard is installed on the pantograph on the top of the electric locomotive, and directly rubs against the wires of the power grid to introduce the current on the power grid into the contact conductive elements of the locomotive. Skateboard materials need to meet or coordinate the performance indicators of the following aspects at the same time: (1) low electrical resistivity and contact resistance; (2) sufficient impact strength; (3) good wear reduction and self-lubricating properties; (4) Certain wear resistance; (5) good heat resistance and arc resistance; (6) certain economy; (7) easy to form and realize lightweight. In the research and application of pantograph slides, its materials have mainly experienced the development process of pure metal slides, p...

Claims

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Application Information

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IPC IPC(8): C22C32/00C22C47/04C22C47/14C22C49/02C22C49/14B60L5/04C22C101/10C22C121/02
Inventor 周卫兵梅炳初朱教群
Owner WUHAN UNIV OF TECH
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