Longitudinal connection method for printed circuit board (PCB)

Abstract

The invention provides a longitudinal connection method for a printed circuit board (PCB). The method comprises the following steps of: 1, providing a first core board and a second core board to be longitudinally connected, a thermoplastic bonding sheet and conductive metal paste, and correspondingly providing conductor layers to be longitudinally connected on the surfaces of the first core boardand the second core board respectively; 2, completely attaching and covering the thermoplastic bonding sheet on one surface, on which the conductor layer to be longitudinally connected is arranged, of the first core board; 3, ablating the bonding sheet covering the conductor layer to be longitudinally connected of the first core board and exposing the conductor layer; 4, printing the conductive metal paste on the conductor layer exposed on the first core board and pre-curing the conductive metal paste for primary forming; and 5, positioning, connecting and laminating the surface, on which theconductor layer is arranged, of the second core board to be longitudinally connected with the conductor layer on the surface, on which the conductive metal paste is printed, of the first core board, and longitudinally connecting the first core board with the second core board by using the printed conductive metal paste. In the method, the PCB is longitudinally connected without copper deposition and copper electroplating processes by using the conductive metal paste, so longitudinal connection between any conductor layers of the PCB can be realized, a product with larger thickness-diameter ratio can be manufactured, and the manufacturing cost is reduced to a certain extent.

Description

technical field [0001] The invention relates to the technical field of printed circuit board (PCB: Printed circuit board), in particular to a method for longitudinally connecting PCB boards by using conductive metal paste. Background technique [0002] At present, in the manufacturing process of PCB circuit boards, the method of longitudinal connection processing is to first drill holes through each layer of the PCB board, and then connect the layers by sinking copper and electroplating copper. However, the use of this connection processing method requires the use of chemical potion process for sinking copper and electroplating copper, which is not suitable for some products that cannot pass through the wet process. Moreover, copper sinking and electroplating copper processes are limited by the thickness-to-diameter ratio of the PCB board, and products with a thickness-to-diameter ratio of ≥16:1 cannot be produced. When the PCB board reaches a certain thickness, the current ...

AI Technical Summary

Problems solved by technology

However, the use of this connection processing method requires the use of chemical potion process copper sinking and electroplating copper, which is not suitable for some products that cannot pass through the wet process

Moreover, copper sinking and electroplating copper processes are limited by the thickness-to-diameter ratio of the PCB board, and products with a thickness-to-diameter ratio of ≥16:1 cannot be produced. When the PCB board reaches a certain thickness, the current connection method will cause damage to the PCB board. The equipment has very high requirements, which is not conducive to the reduction of product manufacturing costs

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