Method for producing a printed circuit board and use and printed circuit board

Abstract

The invention relates to a method for fixing a component (6) to or in a printed circuit board (1) and / or for connecting individual elements of a printed circuit board, wherein regions of a component (6) and / or of a printed circuit board (1) to be interconnected or to be fixed to one another are provided with at least one respective solder layer (4, 5, 9, 10), the solder layers (4, 5, 9, 10) are contacted with each other and are interconnected at a pressure and a temperature that is elevated above ambient conditions, an intermetallic diffusion layer (12) being formed, thereby achieving a high-strength connection. The invention further relates to the use of said method and to a printed circuit board (1).

Description

technical field [0001] The invention relates to a method for fastening components on or in a printed circuit board and / or for connecting individual components of a printed circuit board, as well as the use of this method and a printed circuit board. Background technique [0002] In the production of printed circuit boards, and in particular in the fastening of components on or in printed circuit boards and / or in order to connect individual components of printed circuit boards, for example in the manufacture of rigid-flex printed circuit boards according to current The prior art mainly uses three methods, which may in particular be wire bonding, soldering, gluing by means of electrically conductive or electrically conductive adhesive films or adhesive materials. Plug-in systems are also known which have a relatively large space requirement when producing rigid-flex printed circuit boards. [0003] In wire bonding, through the input of ultrasonic waves, heat and pressure, a m...

AI Technical Summary

Problems solved by technology

[0005] When using an electrically conductive or conductive adhesive film or adhesive, for example due to the filler content of the conductive component in relation to the achievable conductivity and the adhesive strength to be achieved A balance must be found in the interplay between these components such that usually only limited conductivity can be achieved without significantly detrimentally affecting the adhesion properties

Furthermore, when heating an adhesive element, for example consisting of a component or a plurality of electronic components on a printed circuit board, varying degrees of dimensional changes occur depending on the material used, wherein, for example, in the case of passive components The coefficients of expansion of ceramics used, of silicon in the case of active components and of plastics used for bonding films or adhesive materials and of conductive contact points or contact pads or printed circuit boards, for example, on printed circuit boards The coefficient of expansion of the copper in the area of ​​the conductor line differs to a considerable extent, so that temperature fluctuations or temperature alternating loads can lead to damage to the contact points or contact areas formed by means of conductive bonding elements or bonding materials. damage and destruction

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