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Cis circuit test probe card

A technology for circuit testing and probe cards, applied in the field of probe cards, can solve problems such as reducing light scattering, and achieve the effect of reducing the risk of shadows

Inactive Publication Date: 2011-05-04
HERMES EPITEK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the defects of the existing traditional CIS test probe card, and provide a CIS circuit test probe card with a new structure. The adjacent area of ​​a substrate of the CIS circuit test probe card is used to collimate the light before it is projected onto the substrate of the CIS circuit test probe card, so as to effectively reduce the light source and crystal of the collimated light The distance between the circles, thereby reducing light scattering, effectively improves the lack of uniformity (light divergence) projected from light to the wafer, which is very suitable for practical use

Method used

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Embodiment Construction

[0050] For further elaborating the technical means and effect that the present invention takes for reaching the intended invention purpose, below in conjunction with accompanying drawing and preferred embodiment, to its specific implementation, structure, feature and its specific implementation mode, structure, feature and its Efficacy, detailed as follows.

[0051] Some embodiments of the present invention will be described in detail as follows. However, in addition to the following descriptions, the present invention can also be widely implemented in other embodiments, and the protection scope of the present invention is not limited by the embodiments, which shall prevail by the protection scope of the claims. Moreover, in order to provide a clearer description and an easier understanding of the present invention, various parts in the drawings have not been drawn according to their relative sizes, and some dimensions have been exaggerated compared with other relevant dimensi...

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Abstract

The present invention relates to a CIS circuit test probe card. On one hand, the CIS circuit test probe card of the invention collimates light before the light is projected to a substrate of the CIS circuit test probe card through equipping one optical assembly at a region which is adjacent with the substrate of the CIS circuit test probe card, thereby effectively improving on-uniformity (divergency) of the light projected onto the wafer. On the other hand, the CIS circuit test probe card causes small hole(s) on the CIS circuit test probe card through changing the geometric configuration of the hole(s) and the probe(s) of the CIS circuit test probe card. There are small holes corresponding to the CIS chips in a one-on-one fashion, such that each small hole is located over a corresponding CIS chip, thereby effectively reducing the deficiency induced by shadows of probes on the light sensing region of the CIS chips.

Description

technical field [0001] The invention relates to a probe card, in particular to a CIS circuit test probe card. Background technique [0002] The traditional CIS (CMOS Image Sensor) test probe card has some disadvantages, especially when the chip size is gradually reduced and / or the required test environment is becoming more and more strict. [0003] Figure 1A is a schematic diagram showing a conventional CIS chip. Figure 1B is a schematic diagram showing a conventional CIS test probe card. They respectively show the application of a conventional CIS chip and a conventional CIS test probe card. Such as Figure 1A As shown, each CIS chip 10 has a photosensitive area 11 and at least one solder pad 12 around the photosensitive area 11 . Such as Figure 1B As shown, light 165 is emitted from a light source 16 (such as a light bulb), then passes through a test device 17 having a hole 175 , and then passes through a conventional CIS test probe card 18 , and is projected onto a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/067G01R1/073
Inventor 洪乾耀
Owner HERMES EPITEK