Packaging structure and packaging substrate thereof
A technology for packaging substrates and packaging structures, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of short life of organic anti-oxidation layer, increased material cost, appearance defects, etc., to avoid circuit layer oxidation and reduce material cost. , to avoid the effect of appearance defects
Inactive Publication Date: 2011-05-04
SHANGANPIN
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Problems solved by technology
[0004] However, in the known technology, if the nickel layer\gold layer is used for the final metal surface treatment, the material cost will be increased due to the gold layer
However, if the nickel layer\silver layer is used as the final metal surface treatment, the silver layer will be easily oxidized and blackened by air, which will cause appearance defects and lead to poor packaging
[0005] Furthermore, in the known technology, there is also an organic antioxidant layer that prevents oxidation to cover the surface of the silver layer to prevent it from being oxidized or polluted. The bonding of the silver layer leads to a decrease in packaging yield
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[0035] The package structure and package substrate thereof according to preferred embodiments of the present invention will be described below with reference to related drawings, wherein the same elements will be described with the same symbols.
[0036] Please refer to Figure 1A and Figure 1B shown, where Figure 1A It is a partial top view of the package substrate 1 of the preferred embodiment of the present invention, Figure 1B for package substrate 1 along Figure 1A The cross-section of the line A-A in the middle. It should be noted that in Figure 1B In the figure, for clarity, the proportions of the substrate body 11 , the wiring layer 12 and the metal composite layer 13 are not actual proportions.
[0037] The package substrate 1 of this embodiment can be applied in a package structure of a light emitting diode, an integrated circuit package or a package structure of other electronic components. The packaging substrate 1 includes a substrate body 11 , a circuit l...
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Abstract
The invention relates to a packaging structure. The packaging structure comprises a packaging substrate and an electronic element, wherein the packaging substrate comprises a substrate body, a circuit layer and a metal composite layer; the circuit layer is arranged on the substrate body; the metal composite layer is arranged on the circuit layer; the metal composite layer is provided with a nickel layer, a silver layer and a gold layer from the inside to outside in turn; and the electronic element is arranged on the metal composite layer. In the packaging structure, appearance defects caused by oxidation of the silver layer can be avoided, and also the advantages of high connectivity and solderability between the gold layer and gold wires can be fully used so as to improve the reliability of a product.
Description
technical field [0001] The present invention relates to a packaging structure and a packaging substrate thereof, in particular to a packaging substrate of an electronic component, and the electronic component may be a diode crystal grain, an integrated circuit chip or a semiconductor component. Background technique [0002] In various electronic components, such as light-emitting diode chips, a packaging substrate is often used as a carrier, and the electronic components are electrically connected to external circuits through the circuit layer on the packaging substrate. [0003] In the known package substrate, usually on the circuit layer, materials such as nickel layer\gold layer (Ni\Au) or nickel layer\silver layer (Ni\Ag) are used for final metal finish to avoid The wiring layer is exposed to air for too long and oxidizes. [0004] However, in the known technology, if the nickel layer\gold layer is used for the final metal surface treatment, the material cost will incre...
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IPC IPC(8): H01L23/498H01L33/62
CPCH01L2224/16225H01L2224/32225H01L2224/45144H01L2224/48091H01L2224/48227H01L2224/73265
Inventor 陈宏男
Owner SHANGANPIN