Reflector, manufacturing method thereof and luminescent device applying same

一种制作方法、发光器件的技术,应用在半导体器件、电气元件、电路等方向,能够解决短路失效、发光二极管漏电、渗透等问题,达到降低漏电概率、面积小的效果

Active Publication Date: 2011-05-11
QUANZHOU SANAN SEMICON TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Silver is the metal with the highest reflectivity in nature, and it is widely used in flip-chip light-emitting diodes, but silver is prone to electromigration effects, and because gallium nitride-based materials are generally based on substrate growth with mismatched lattice and thermal expansion coefficients There is a large density of dislocation defects in the crystal, and the electromigration of silver can easily penetrate into the active layer through the dislocation defects, which will cause leakage or short circuit failure of the light emitting diode.

Method used

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  • Reflector, manufacturing method thereof and luminescent device applying same
  • Reflector, manufacturing method thereof and luminescent device applying same
  • Reflector, manufacturing method thereof and luminescent device applying same

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Embodiment Construction

[0059] Combine below Figure 1~Figure 6 and preferred embodiments to further illustrate the present invention.

[0060] Such as figure 1 Shown is a cross-sectional view of a preferred reflector for gallium nitride-based light-emitting devices of the present invention.

[0061] The reflector 100 is formed on the p-type GaN-based epitaxial layer 10 . The reflector 100 is composed of two parts, one is a whisker 11, the material is u-GaN, which is formed on the p-type GaN-based epitaxial layer 10, and distributed in the p-type GaN-based epitaxial layer according to a certain density The surface of 10 and its position correspond to the dislocation defects of the epitaxial layer; the second is the Ag reflective layer 12, which is formed on the p-type GaN-based epitaxial layer 10 and the whiskers 11.

[0062] The whiskers 11 contained in the reflector 100 of this embodiment are placed on the dislocation defects of the p-type GaN-based epitaxial layer 10, and can separate the Ag re...

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Abstract

The invention discloses a reflector used for a gallium nitride-based luminescent device and a manufacturing method thereof and a luminescent device applying the reflector. The reflector is formed on a P-type gallium nitride-based epitaxial layer and comprises whisker crystals and a metal reflecting layer, wherein the whisker crystals are made from undoped gallium nitride, distributed in a certain density, formed on the surface of the P-type gallium nitride-based epitaxial layer in a position corresponding to a dislocation defect of the epitaxial layer; and the metal reflecting layer is formed on the P-type gallium nitride-based epitaxial layer and the whisker crystals. Undoped gallium nitride-based whisker crystals are arranged on the dislocation defect of the P-type GaN-based epitaxial layer, thus an Ag reflecting layer can be separated from the dislocation defect of the P-type GaN-based epitaxial layer, Ag is effectively inhibited from permeating into the inside of the dislocation defect in an electromigration way and electric leakage probability of the luminescent device comprising an Ag reflector can be greatly decreased.

Description

technical field [0001] The invention relates to a reflector for a gallium nitride-based light-emitting device, a manufacturing method thereof, and a gallium-nitride-based light-emitting device including the reflector. Background technique [0002] In recent years, semiconductor lighting technology represented by gallium nitride-based wide bandgap semiconductor materials has developed rapidly. Gallium nitride-based light-emitting diode devices have been widely used in various fields such as display, indication, backlight and lighting. [0003] For gallium nitride-based light-emitting diodes, the most common epitaxial structure is the p-type epitaxial layer on the top surface (p-side up), and according to the light-emitting surface, it can be divided into conventional structure and flip-chip structure. The gallium nitride-based light-emitting diode with a conventional structure uses the p-type layer as the light-emitting surface. In order to expand the current and increase th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/46H01L33/00C25F3/14
CPCH01L33/10H01L33/22H01L33/46H01L33/0093
Inventor 潘群峰吴志强林科闯
Owner QUANZHOU SANAN SEMICON TECH CO LTD
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