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Semiconductor laser device capable of deep cooling and sealing device thereof

A sealing device and laser technology, used in semiconductor lasers, lasers, laser parts and other directions, can solve the problems of easy condensation, high temperature drift, poor cooling capacity, etc., to prevent condensation, avoid temperature drift, and prolong life. Effect

Inactive Publication Date: 2011-05-11
INST OF PHYSICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing semiconductor laser sealing device has the problems of poor cooling capacity, high temperature drift, and easy condensation

Method used

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  • Semiconductor laser device capable of deep cooling and sealing device thereof
  • Semiconductor laser device capable of deep cooling and sealing device thereof
  • Semiconductor laser device capable of deep cooling and sealing device thereof

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Embodiment Construction

[0027] The sealing device of semiconductor laser according to an embodiment of the present invention, such as figure 1 As shown, it includes two parts, the vacuum cap 100 and the base 200. The vacuum cap 100 and the base 200 can be combined to form a closed cavity. By vacuuming the closed cavity, the semiconductor laser in the closed cavity is in a vacuum. In the environment, the airtight cavity also has a cooling device and an electrical connection device, thereby providing a low-temperature environment and working current for the semiconductor laser. The specific structure of the sealing device will be described in detail below.

[0028] Wherein the structure of the vacuum cap 100 is as figure 2 As shown, it includes a vacuum cap top 101 and a vacuum cap side wall 102, wherein the vacuum cap top 101 is circular, which is combined on the cylindrical vacuum cap side wall 102, and the vacuum cap top 101 has a vacuum interface 106 and a socket hole 110. There is an outwardly...

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Abstract

The invention provides a sealing device of a semiconductor laser device, which comprises a vacuum cap and a base, wherein the vacuum cap is formed by a top part and a side wall, a vacuum interface and a plug seat hole are formed at the top part of the vacuum cap, a lower edge extending outwards is arranged at the lower part of the side wall of the vacuum cap, a groove is formed at the lower part of the lower edge, a sealing ring is plugged into the groove, a light output tube extending outwards is arranged on the side wall of the vacuum cap, and a light outlet is formed at the tail end of the light output tube; and the base comprises a base station and a base station edge, and a vacuum cavity is formed by the vacuum cap and the base station in a circling manner. Therefore, the invention ensures that an excellent vacuum cavity with a good sealing performance is formed, condensation on the surface of the surface of the laser tube under a low temperature is prevented, the temperature can be reduced further, and temperature drift can be effectively avoided. The invention further provides a laser device sealed with the sealing device.

Description

technical field [0001] The present invention relates to a sealing device for a semiconductor laser, and to a semiconductor laser device using the sealing device. Background technique [0002] The semiconductor laser tube is restricted by its principle, and the wavelength of its outgoing laser can only change within a small range, and it is mainly modulated by temperature. By adjusting the temperature, the wavelength can be changed by up to a dozen nm. Generally speaking, the average temperature is reduced by 5 degrees, and the wavelength is reduced by 1 nm. Not all wavelengths of commercial laser tubes are available, but only several discrete wavelengths, such as 405nm, 642nm, 650nm, 658nm, 670nm, 785nm, 808nm, 830nm, etc. If a specific wavelength is required, it is often necessary to cool down or heat up, but most laser tubes can withstand a maximum temperature of no more than 70 degrees, and the higher the temperature, the shorter the life, so generally choose a laser wit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/022H01S5/024
Inventor 曹强王如泉罗鑫宇
Owner INST OF PHYSICS - CHINESE ACAD OF SCI
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