Method for enhancing welding reliability of high-frequency quad flat no lead (QFN) device
A reliability and device technology, which is applied in the field of reliable welding of high-frequency QFN devices, can solve problems such as QFN device failure, increased solder joint stress, and increased assembly stress, so as to solve the problem of increased welding stress, reduced thermal stress, and reduced The effect of welding stress
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Example Embodiment
[0031] Example 1:
[0032] The assembling method designed by the invention is adopted, that is, a lining board is added between the printed board and the shell, the lining board material is brass H62 (thermal expansion coefficient 16ppm / ℃), and the thickness is 2mm. The number of test pieces is 4 pieces, numbered B01~B04.
[0033] 1. Basic conditions
[0034] (1) Printed board
[0035] In order to effectively verify the welding quality of QFN devices, the printed circuit board in this embodiment is simplified to avoid introducing other factors, such as Figure 4 Shown is a schematic diagram of the structure of the printed board of the present invention. In the figure, the surrounding pin pads and belly ground pads of the printed board corresponding to the QFN device can be clearly seen. The printed board is made of Rogers 4350B and has a thickness of 0.254 mm.
[0036] (2) Components
[0037] According to the printed circuit board design, see Table 1 for the supporting components of a ...
Example Embodiment
[0075] Example 2:
[0076] The assembly method designed in the present invention is adopted, namely: a liner is added between the printed board and the shell, and the material of the liner is Kefa alloy (thermal expansion coefficient 8ppm / °C). The number of test pieces is 4 pieces, numbered C01~C04.
[0077] 1. Basic conditions
[0078] (1) Printed board
[0079] Same as "Example" 1.
[0080] (2) Components
[0081] Same as "Example 1".
[0082] (3) Solder and flux
[0083] Same as "Example 1".
[0084] (4) Production and testing tools and equipment
[0085] Same as "Example 1".
[0086] 2. Process implementation steps
[0087] Step (1), component matching
[0088] Same as "Example 1".
[0089] Step (2),
[0090] Same as "Example 1".
[0091] Step (3),
[0092] Same as "Example 1".
[0093] Step (4),
[0094] Same as "Example 1".
[0095] Step (5), solder paste is missing
[0096] Same as "Example 1".
[0097] Step (6) Patch
[0098] Same as "Example 1".
[0099] Step (7), reflow soldering
[0100] Same a...
Example Embodiment
[0107] Example 3:
[0108] The assembly method designed in the present invention is adopted, namely: a liner is added between the printed board and the shell, and the material of the liner is Kefa alloy (thermal expansion coefficient 8ppm / °C). The amount of solder paste applied to the solder joints of the device is controlled by adjusting the size of the leakage plate opening. A 0.15mm thick leakage plate is selected. The size of the leakage plate opening is appropriately reduced relative to the size of the pad. The shrinkage ratio is: 70% of the surrounding pin pads 4. 4 test pieces with 65% of the belly ground pads, numbered D01~D04; 4 pieces of test pieces with 56% of the surrounding pin pads and 51% of the belly ground pads, numbered D05~D08.
[0109] 1. Basic conditions
[0110] (1) Printed board
[0111] Same as "Example 1".
[0112] (2) Components
[0113] Same as "Example 1".
[0114] (3) Solder and flux
[0115] Same as "Example 1".
[0116] (4) Production and testing tools and e...
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