Copper clad laminate and impregnation liquid for making same

A copper foil substrate and immersion technology, which is applied to the copper foil substrate and the immersion liquid used to make the copper foil substrate, can solve the problems of increased drill loss, increased defect rate, and more dust.

Active Publication Date: 2011-06-08
SIBELCO ASIA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high-hardness substrate has the advantage of not being easily deformed. However, when drilling is required, the difficulty of the drilling process is relatively high, and the loss of the drill bit is also increased.
In addition, the drilling process produces too much dust, which also increases the defective

Method used

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  • Copper clad laminate and impregnation liquid for making same
  • Copper clad laminate and impregnation liquid for making same
  • Copper clad laminate and impregnation liquid for making same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] figure 1 It shows a general process for manufacturing glass fiber copper foil substrates, which includes: sending glass fiber cloth 10 into an impregnation tank 12 containing impregnation liquid. After being heated by a heater 14, it is cut to a predetermined size with a cutter 16 to form several prepregs 18 for future use. Next, a predetermined number of prepregs 18 are stacked together with a predetermined fiber direction, and a copper foil 20 is respectively arranged on the top surface and the bottom surface, and the hot-molded sheet 22 is performed. After the hot-molded plate is properly trimmed 24, a copper foil substrate 26 with a glass fiber substrate in the center and copper foil on both sides can be obtained. The overall structure of the copper foil substrate 26 is composed of a plurality of prepregs 18 and It is composed of at least one copper foil 20, and each of the prepregs 18 is composed of glass fiber cloth 10 and impregnated material (after the impregna...

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PUM

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Abstract

The invention relates to a copper clad laminate comprising a glass fiber substrate and at least one copper foil combined on at least one side surface of the glass fiber substrate, wherein the glass fiber substrate is formed by the steps of impregnating a piece of glass fiber cloth in an impregnation liquid to prepare a half-solid film and then combining the half-solid film with the copper foils to prepare the copper clad laminate through pressuring and heating, wherein the impregnation liquid comprises a resin and a filler of 5-80 PHR (Parts per Hundreds of Resin), and the filler is a non-crystalline net-structured composite material which is co-constituted by silicon dioxide and one or more of IIA or IIIA metallic oxides. The copper clad laminate has appropriate hardness and linear expansion coefficient.

Description

technical field [0001] The present invention is related to electronic circuits, and more specifically refers to a copper foil substrate and an impregnating solution used for making the copper foil substrate. Background technique [0002] A printed circuit board (PCB) is a substrate with a predetermined circuit pattern, on which various electronic components can be mounted to achieve predetermined functions. The quality of printed circuit boards not only affects the reliability of electronic products, but also affects the overall performance of electronic products. Copper clad laminate (CCL) is the basic material for manufacturing printed circuit boards. It is made of insulating paper, glass fiber cloth or other fiber materials impregnated with epoxy resin or phenolic resin adhesive. It is made by combining, and then covered with copper foil on one or both sides, and formed under heat and pressure. Copper foil substrates based on glass fiber have become the mainstream of co...

Claims

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Application Information

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IPC IPC(8): H05K1/03C08L63/00C08K3/36C08K3/22
Inventor 杨天奕周振崇何清潭汤惟行
Owner SIBELCO ASIA
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