Copper clad laminate and impregnation liquid for making same

Abstract

The invention relates to a copper clad laminate comprising a glass fiber substrate and at least one copper foil combined on at least one side surface of the glass fiber substrate, wherein the glass fiber substrate is formed by the steps of impregnating a piece of glass fiber cloth in an impregnation liquid to prepare a half-solid film and then combining the half-solid film with the copper foils to prepare the copper clad laminate through pressuring and heating, wherein the impregnation liquid comprises a resin and a filler of 5-80 PHR (Parts per Hundreds of Resin), and the filler is a non-crystalline net-structured composite material which is co-constituted by silicon dioxide and one or more of IIA or IIIA metallic oxides. The copper clad laminate has appropriate hardness and linear expansion coefficient.

Description

technical field [0001] The present invention is related to electronic circuits, and more specifically refers to a copper foil substrate and an impregnating solution used for making the copper foil substrate. Background technique [0002] A printed circuit board (PCB) is a substrate with a predetermined circuit pattern, on which various electronic components can be mounted to achieve predetermined functions. The quality of printed circuit boards not only affects the reliability of electronic products, but also affects the overall performance of electronic products. Copper clad laminate (CCL) is the basic material for manufacturing printed circuit boards. It is made of insulating paper, glass fiber cloth or other fiber materials impregnated with epoxy resin or phenolic resin adhesive. It is made by combining, and then covered with copper foil on one or both sides, and formed under heat and pressure. Copper foil substrates based on glass fiber have become the mainstream of co...

AI Technical Summary

Problems solved by technology

The high-hardness substrate has the advantage of not being easily deformed. However, when drilling is required, the difficulty of the drilling process is relatively high, and the loss of the drill bit is also increased.

In addition, the drilling process produces too much dust, which also increases the defective rate

In addition, due to the difference in the linear expansion coefficient of the substrate and other materials, a high linear expansion coefficient will lead to the generation of internal stress

Under the process of alternating cold and hot, it is easy to cause microcracks on the substrate and circuit breakage

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