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High-power illumination LED (light emitting diode) light source rapid heat conduction packaging structure

A technology of LED light source and packaging structure, which is applied in the cooling/heating device of lighting devices, lighting devices, lighting and heating equipment, etc., and can solve problems such as difficult spot shape and lighting direction, poor lighting uniformity, and serious light scattering. To achieve the effect of improving the utilization rate of lighting, improving the visibility of LEDs, and preventing light pollution

Inactive Publication Date: 2011-06-29
江苏欣力光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the basis of improving the power of the packaged LED, the package structure solves the problems of serious light scattering, poor illumination uniformity, difficult control of spot shape and light direction, and serious glare interference in the existing package structure.

Method used

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  • High-power illumination LED (light emitting diode) light source rapid heat conduction packaging structure
  • High-power illumination LED (light emitting diode) light source rapid heat conduction packaging structure
  • High-power illumination LED (light emitting diode) light source rapid heat conduction packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Embodiment 1: A high-power lighting-level LED light source fast heat conduction packaging structure, such as figure 1 As shown, it includes a collar 1, an optical lens 2, a bracket 3, an LED chip 5, a thermal buffer 6 and a fixed base plate 7, the bracket 3 is placed in the central cavity of the thermal buffer 6, and the optical lens 2 is placed in the thermal buffer 6 In the groove on the upper surface, the collar 1 is fixed on the heat buffer 6 by bolts, and the heat buffer 6 is fixed on the bottom plate 8 by bolts. The longitudinal section of the optical lens 2 is arched, such as figure 2 As shown, there is a group of special prismatic protrusions on the concave surface of the dome of the lens 2. Such as Figure 4 As shown, the prismatic protrusions are arranged along the longitudinal section of the lens 2, and the prismatic protrusions are parallel to each other in a grid shape, and the cross-section of the prismatic protrusions is rectangular. The manufacturing...

Embodiment 2

[0028] Embodiment 2: As the technological improvement of embodiment 1, use high borosilicate optical glass or K9 optical glass as the material of optical lens 2, make optical lens 2 thickness between 3mm to 20mm, its transmittance reaches 96%, can Effectively reduce light loss. High borosilicate optical glass or K9 optical glass can withstand a high temperature of 200°C, and will not affect the optical performance of the optical lens 2 due to high temperature, ensuring the stable operation of the packaging structure at high temperature.

Embodiment 3

[0029] Embodiment 3: As a technical improvement of Embodiment 1, the bracket 3 is made of a material whose substrate is copper and whose surface is a silver structural layer. The support 3 can effectively transfer heat and reflect light. The upper part of the support 3 is an inverted cone structure, which matches the central cavity of the heat buffer. The upper surface of the support 3 is a circular groove for arranging the LED chips 5 and Phosphor powder, its elliptical crystal layout can maximize the utilization rate of light. The phosphor powder adopts superior three-color phosphor powder, which has the characteristics of high light efficiency, adjustable color, and good color rendering. There are two symmetrical electrode pins at both ends of the groove of the bracket 3 . The electrode pins are insulated with high temperature resistant plastic, and the maximum working temperature can reach 300°C. The electrode 4 at the lower end of the bracket 3 can pass a certain amount ...

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PUM

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Abstract

The invention relates to a high-power illumination LED (light emitting diode) light source rapid heat conduction packaging structure which comprises a retainer ring, an optical lens, a bracket, a heat buffer and a fixed base plate, wherein the longitudinal section of the lens is of an arch type, and the concave surface of the arch top of the lens is provided with a group of special edge-shaped bulges; the heat buffer is of a hollow aluminum seat body; the bracket serves as an LED chip fixing seat; the size of the bracket is adaptive to the cavity of the heat buffer; the top of the bracket is a groove capable of reflecting lights; the LED chip is placed at the bottom of the groove; two sides of the groove are provided with wire guide holes; each wire guide hole is provided with an insulated wire; the top of each insulated wire serves as an LED chip positive and negative wire guide column; and the bottom of each insulated wire is communicated with the bottom part of the heat buffer and is connected with a wire terminal. The package structure has the advantages of compact structure and quick heat conduction, and is simple and convenient to manufacture; and the power and service life of the packaged LED can be improved, the light scattering can be reduced, the illumination uniformity can be improved, the hexagon flare is controlled, the illumination direction can be controlled, and no glare interference exists.

Description

[0001] technical field [0002] A light source package, in particular to a high-power lighting-level LED light source package structure with rapid heat conduction. Background technique [0003] LED (Light Emitting Diode) packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. The packaging of LED not only needs to be able to protect the wick, but also to be able to transmit light, so the packaging of LED has special requirements for packaging materials. LED packaging is to complete the output of electrical signals, protect the normal operation of the die, and output visible light. It has both electrical parameters and optical parameters design and technical requirements, and ordinary packaging technology cannot be simply used. [0004] The core light-emitting part of the LED is a pn junction tube core of p-type and n-type semiconductors. When the pn junction passes current, electrons and holes move and combine...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V5/04F21V19/00F21V23/06F21V29/00F21Y101/02F21V29/508F21V29/71F21Y115/10
Inventor 牟小波陆春明
Owner 江苏欣力光电有限公司