White light LED (light-emitting diode) and packaging method thereof

A packaging method and LED chip technology, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of accelerating the light decay of phosphor powder in white LEDs, shortening the life of LED light-emitting devices, and aging, so as to improve the service life and enhance Stability, the effect of lowering the heating temperature

Inactive Publication Date: 2011-06-29
OCEANS KING LIGHTING SCI&TECH CO LTD +1
View PDF4 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, there are still a series of problems in the packaging method of white light LED widely used at present, for example: phosphor and organic packaging materials will age under long-term high temperature and light irradiation, especially in high-power integrated chip LEDs (such as : 20W, 30W, 50W and 100W LEDs), the temperature of the phosphor powder glue surface of the LED is relatively high, which will accelerate the light decay of the phosphor powder glue in the white LED, and shorten the life of the LED light-emitting device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • White light LED (light-emitting diode) and packaging method thereof
  • White light LED (light-emitting diode) and packaging method thereof
  • White light LED (light-emitting diode) and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Such as figure 2 Shown is a cross-sectional view of Embodiment 1 of the present invention. figure 2 The packaging of the white LED 1 shown is to fix a blue LED chip 11 with a wavelength of 455nm on the base 12; then coat the blue LED chip 11 with cerium-doped yttrium aluminum garnet (YAG:Ce 3+ ) phosphor glue 13; then a common glass 14 coated with an AlN film 15 with a thickness of 50nm is covered on the phosphor glue 13, and it is not coated with the other surface of the AlN film 15 with the phosphor glue 13 closely fit together to obtain a semi-finished LED product; then, move the semi-finished LED product to an oven and keep it warm at 120°C for 2 hours to cure the fluorescent powder glue 13, and then keep it warm at 150°C for 2 hours to completely solidify the phosphor powder glue 13 ,get figure 2 White LED 1 shown.

Embodiment 2

[0037] Such as image 3 Shown is a cross-sectional view of Embodiment 2 of the present invention. image 3 The packaging of the white LED 2 shown is to fix a blue LED chip 21 with a wavelength of 480nm on the base 22; then coat the blue LED chip 21 with organic transparent silica gel 23; The luminescent glass 24 that can emit yellow light of the film 25 is covered on the organic transparent silica gel 23, and the other surface that is not coated with the BN film 25 is closely attached to the organic transparent silica gel 23 to obtain the LED semi-finished product; subsequently, the The LED semi-finished product was moved to an oven, and kept at 100°C for 3 hours to solidify the organic transparent silica gel 23, and then kept at 170°C for 1 hour to completely solidify the organic transparent silica gel 23 to obtain image 3 White LED 2 shown.

Embodiment 3

[0039] like Figure 4 Shown is a cross-sectional view of Embodiment 3 of the present invention. Figure 4 The packaging of the white LED 3 shown is to fix a purple LED chip 31 with a wavelength of 320nm on the base 32; then coat the organic transparent silica gel 33 on the purple LED chip 31; The luminescent glass 34 of the diamond film 35 that can emit white light under the excitation of 365nm light is covered on the organic transparent silica gel 33, and the other surface that is not coated with the transparent diamond film 35 is closely attached to the organic transparent silica gel 33 to obtain LED semi-finished products; subsequently, the LED semi-finished products are moved to an oven, and kept at 130°C for 1 hour to solidify the organic transparent silica gel 33, and then kept at 140°C for 5 hours to completely solidify the organic transparent silica gel 33 to obtain Figure 4 White LED 3 shown.

[0040] In summary, the white light LED of the present invention and its...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a white light LED (light-emitting diode) and a packaging method thereof. The white light LED comprises a base and an LED chip fixed on the base, wherein a silicone layer is arranged on the LED chip, the silicone layer is covered by a glass layer and is tightly close to the glass layer, and a heat-conduction thin-film with high heat conductivity is plated on the glass layer. The packaging method of the white light LED comprises the following steps: fixing the LED chip on the base; arranging the silicone layer on the LED chip; plating the heat-conduction thin-film with high heat conductivity on one surface of the glass layer; and covering the silicone layer with the glass layer plated with the heat-conduction thin-film to enable the glass layer to be tightly close to the silicone layer, transferring into an oven, and performing precuring curing. According to the invention, during packaging, the glass layer is arranged on the outer surface of the silicone layer, and the heat-conduction thin-film with high heat conductivity is plated on the glass layer, so that the heat dissipation speed of the silicone layer in the air is increased, and the service life of the LED is prolonged.

Description

technical field [0001] The invention relates to the technical field of semiconductor LED lighting and display, and more specifically, to a white light LED and a packaging method thereof. Background technique [0002] Due to the excellent characteristics of light-emitting diodes (LEDs), such as long life, low energy consumption, and fast start-up, LED light-emitting devices have been widely used in signal lights, automobile lights, large-screen displays, and lighting. At present, the most commonly used white LED is to use the combination of blue LED chips and phosphors to obtain white light. The typical packaging method of white light LED is to put phosphor glue on the blue light chip and then bake it after wire bonding. This is a method widely used in commercial white light LED packaging at present. This packaging method can be easily Obtain white light LED, the luminous efficiency of commercial white light LED can reach 80lm / W at present. [0003] However, there are still...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64
Inventor 周明杰马文波时朝璞陈贵堂罗茜
Owner OCEANS KING LIGHTING SCI&TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap