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Method for testing porosity of electric connector gold-plating layer

An electrical connector and testing method technology, applied in the field of electrical connector gold-plated layer porosity testing, can solve problems such as potential safety hazards for experimental operators, and achieve the effects of high safety, improved testing efficiency and testing accuracy

Inactive Publication Date: 2013-10-16
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is relatively simple to operate, but the CdS used is highly toxic, which poses a safety hazard to the experimental operators.

Method used

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  • Method for testing porosity of electric connector gold-plating layer
  • Method for testing porosity of electric connector gold-plating layer
  • Method for testing porosity of electric connector gold-plating layer

Examples

Experimental program
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Effect test

Embodiment Construction

[0036] The present invention comprises the following steps:

[0037] (1) Clean the surface of the sample until the surface of the sample is clean and free of dirt. In this process, in order to facilitate the observation and cleaning of the sample surface, a 20x microscope is usually required. When cleaning the surface of the sample, you can use clean tweezers, lens cleaning paper or cotton to wipe the surface of the sample, or use dry oil-free air to blow off the dirt on the surface until the surface of the sample is clean.

[0038] (2) Hang the sample in step (1) in an airtight container. Hanging the sample in an airtight container can prevent the sample test surface from being blocked and affect the test results.

[0039] (3) Prepare 5wt% sodium hypochlorite solution and 2wt% acid solution, which can be hydrochloric acid, nitric acid or sulfuric acid solution. Test structure like figure 2 As shown, the two solutions are mixed according to the same ratio and poured into ...

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Abstract

The invention provides a method for testing the porosity of an electric connector gold-plating layer, which comprises the following steps of: (1) cleaning the surface of a sample; (2) hanging the sample in a sealed container; (3) preparing sodium hypochlorite solution and acid liquor, mixing the sodium hypochlorite solution with the acid liquor and pouring the mixture into the sealed container to be sealed together with the sample, and standing still for 30 to 50 minutes, wherein the level of the mixed solution is lower than the sample and the temperature inside the sealed container is 21 to 25 DEG C; (4) drying the sample; and (5) observing the surface of the sample, calculating the number of corrosion spots according to the size of every observed corrosive, then adding up all the numbers of the corrosion spots in the test region, and calculating the porosity according to the total number of the corrosion spots and the test area of the sample. The method obtains the porosity simply, conveniently and accurately by mixing the hypochlorite solution with the acid liquor in the sealed container, performing chemical reaction between volatile gas and the sample and reasonably controlling time and space, the test process of the method is completed in the sealed container, and the test medium is nonhazardous and is extremely environmentally-friendly and safe.

Description

technical field [0001] The invention relates to the technical field of chemical industry, in particular to a method for testing the porosity of a gold-plated layer of an electrical connector. Background technique [0002] Currently as figure 1 As shown, most electrical connector terminals are made of copper alloy 1, which usually corrodes in the use environment, such as oxidation, vulcanization, etc. In order to prevent the corrosion of copper alloy 1 and maintain the long-term stability of the metal contact surface of the electrical connector, a layer of precious metal-gold and its alloy 3 is often electroplated on the terminals of the electrical connector. In addition, in order to prevent the mutual diffusion of copper 1 and gold 3 and the diffusion of corrosion products of copper alloy 1 to the surface of gold-plated layer 3 , a nickel layer 2 is electroplated between copper 1 and gold-plated layer 3 . [0003] Due to the rising price of gold, in order to reduce the cos...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N15/08
Inventor 刘忠祥宋好强
Owner ZTE CORP
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