Solid-state light-emitting component and light source module

A solid-state lighting and light source module technology, applied to semiconductor devices, light sources, electrical components, etc. of light-emitting elements, can solve the negative impact of the conductive performance of the light-emitting diode 100, the overall heat dissipation performance of the light-emitting diode 100 is poor, and the increase of the light-emitting diode 100 Thermal resistance and other issues to achieve the effect of good heat dissipation performance

Inactive Publication Date: 2011-07-20
FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC +1
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  • Summary
  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, since the metal frame 1020 is used as an electrode to electrically connect the LED chip 104 and to dissipate heat from the LED chip 104, this aspect increases the thermal resistance of

Method used

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  • Solid-state light-emitting component and light source module
  • Solid-state light-emitting component and light source module
  • Solid-state light-emitting component and light source module

Examples

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Example Embodiment

[0018] The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0019] see figure 2 The first embodiment of the present invention provides a solid-state light-emitting element 10 , which includes: a solid-state light-emitting chip 11 , a heat dissipation layer 13 , an electrical insulating layer 15 , and two electrode pin layers 17 .

[0020] The solid-state light-emitting chip 11 can be specifically an LED chip 11, which has a light-emitting surface 110 and a bottom surface 112 opposite to the light-emitting surface 110, and a positive electrode (not shown) and a negative electrode are disposed on the light-emitting surface 110 (not shown). Specifically, the LED chip 11 may contain phosphide such as Al x In y Ga (1-x-y) P(0≤x≤1, 0≤y≤1, x+y≤1) or arsenide such as AlInGaAs, the LED chip 11 containing phosphide or arsenide can emit visible light in the yellow light to red light band. Of course, the LE...

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Abstract

The invention relates to a solid-state light-emitting component with a favorable heat-radiating property, which comprises a heat radiating layer, an electric insulation layer, two electrode pin layers and one solid-state light-emitting chip. The heat radiating layer is provided with a first surface, the electric insulation layer is arranged on the first surface of the heat radiating layer, the side of the electric insulation layer, far away from the heat radiating layer, is provided with a second surface, the electric insulation layer can expose the heat radiating layer by inwards processing a through hole on the second surface, and the heat radiating layer is provided with a bearing surface corresponding to the through hole. The two electrode pin layers are mutually isolated and are respectively on the second surface, and one side of each electrode pin layer, far away from the electric insulation layer, is provided with a third surface. The solid-state light-emitting chip is arranged on the bearing surface and is electrically connected with the two electrode pin layers respectively. In addition, the invention further relates to a light source module comprising the solid-state light-emitting component.

Description

technical field [0001] The invention relates to a solid-state light-emitting element and a light source module containing the solid-state light-emitting element. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a solid-state light-emitting element, and its electrical and optical characteristics and lifetime are sensitive to temperature. Generally, higher temperature will lead to lower internal quantum effects and significantly shorten the lifetime; and the resistance of semiconductors will decrease with the increase of temperature, and the sliding resistance will bring larger current and more heat generation, Cause heat accumulation; this heat damage cycle tends to accelerate the destruction of the working performance of the light emitting diode. [0003] Such as figure 1 As shown, a typical light emitting diode 100 includes: a package body 102 , a light emitting diode chip 104 and a resin layer 106 . The package body 102 is formed by in...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/62H01L33/64H01L25/13
CPCH05K1/0203H05K1/021H01L33/54F21V29/225H05K2201/09054H05K2201/10106H05K1/182H05K1/189H01L33/64H01L2924/01322H01L33/486F21V29/246F21K9/00H01L33/62H01L2224/48091H05K3/284F21Y2101/02F21V29/763F21V29/89F21Y2115/10H01L2924/00014
Inventor 赖志铭
Owner FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC
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