Laser dicing device

Abstract

A laser dicing device is provided to perform dicing processing that has excellent cutting properties and is stable even when the dicing speed is changed. The laser dicing apparatus includes: a stage; a reference clock oscillation circuit; a laser oscillator that emits a pulse laser beam; a laser oscillator controller that synchronizes the pulse laser beam with the clock signal; a pulse picker that switches irradiation and non-irradiation of the pulse laser beam onto the substrate to be processed; a pulse picker controller that controls pass and interception of the pulse laser beam for each light pulse in synchronization with the clock signal; a processing table unit that stores a processing table in which dicing processing data with respect to a standard relative velocity between the substrate to be processed and the pulse laser beam is written; a velocity input unit that inputs a new set value of a relative velocity; and an operation unit that calculates a new processing table and stores the new processing table into the processing table unit. Based on the new processing table, the pulse picker controller controls pass and interception of the pulse laser beam.

Description

[0001] This application is based on and claims priority from Japanese Patent Application (JPA) No. 2010-011348 filed on January 21, 2010, the entire contents of which are incorporated herein by reference. technical field [0002] The present invention relates to a laser sectioning device using a pulsed laser beam. Background technique [0003] Japanese Patent No. 3867107 discloses a method of using a pulsed laser beam for slicing a semiconductor substrate. In this method, a crack region is formed inside the object to be processed due to optical damage caused by a pulsed laser beam. Then, the object to be processed is cut from the crack region as a starting point. [0004] In the conventional technology, the formation of the crack region is controlled by using the energy of the pulsed laser beam, the spot size, the relative moving speed of the pulsed laser beam and the object to be processed, and the like as parameters. [0005] However, in the conventional method, there is...

AI Technical Summary

Problems solved by technology

[0005] However, in the conventional method, there is a problem that the generation of cracks cannot be sufficiently controlled, such as cracks occurring in unexpected places.

Therefore, it is particularly difficult to use for slicing hard substrates such as sapphire or slicing with a narrow cutting width.

In addition, when the slicing speed is changed, for example, to control productivity, it is difficult to achieve stable slicing before and after the speed change

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