Method for manufacturing locating marker on wafer
A technology for positioning marks and wafers, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as inability to operate judgment or measurement, difficult to accurately position wafers, unscientific, etc., to save downtime operation time , The effect of reducing operational complexity and improving production efficiency
Active Publication Date: 2012-12-05
SEMICON MFG INT (SHANGHAI) CORP +1
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Problems solved by technology
Therefore, it is difficult to accurately position the wafer on the operating table for operation with the naked eye or other rough measurement tools, and it is also impossible to accurately judge or measure whether the operation meets the specified requirements.
Therefore, this method of calibrating positioning or operating specifications by naked eyes or other rough measurement tools is very unscientific, and often causes some defects or adverse effects due to the influence of human factors
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[0041] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.
[0042] In order to thoroughly understand the present invention, the wafer and the method for making alignment marks on the wafer will be described in detail in the following description. Obviously, the practice of the invention is not limited to specific details familiar to those skilled in the semiconductor arts. Preferred embodiments of the present invention are described in detail below, however, the present invention may have other embodiments besides these detailed descriptions.
[0043] figure 1 Shown is a schematic diagram of a wafer according to one e...
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The invention relates to a wafer and method for manufacturing a locating marker thereon, wherein the wafer is provided with the locating marker. The method comprises the following steps: a) any pattern on a photomask is selected as a reference pattern; b) the wafer is uniformly divided along horizontal and vertical directions to obtain a series of points of intersection; c) coordinates are defined for each point of intersection; d) the locating marker is determined according to the coordinates for the points of intersection obtained in the step c); e) the reference pattern selected out in thestep a) is used for exposing the locating marker determined in the step d); and f) the exposed locating marker is etched. The invention can accurately locate the wafer on an operating machine; besides, the invention can guarantee the processing precision to meet requirements and avoids bad influences like anthropic factors, etc. Meanwhile, the serial numbers of the wafers can be searched conveniently and quickly. In addition, redundant operations can not be caused so as to achieving the purposes of saving the time and improving the efficiency.
Description
technical field [0001] The invention relates to the field of semiconductor manufacturing, more particularly to a method for making positioning marks on a wafer. Background technique [0002] In semiconductor manufacturing technology, the photolithography process is the most critical process among the four basic processes for wafer manipulation, which determines the critical dimensions of devices. Errors in the photolithography process and misalignment of the pattern may cause distortion or poor registration of the pattern on the wafer, which can eventually translate into adverse effects on the electrical characteristics of the device. [0003] Before various operations can be performed, the wafer needs to be placed on the stage. However, since there is no effective means or method to judge the position of the wafer, it often causes the wafer to be biased, which is very unfavorable for accurate operation of subsequent processes. In addition, in the edge photoresist removal ...
Claims
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IPC IPC(8): H01L21/00
Inventor 任林伟
Owner SEMICON MFG INT (SHANGHAI) CORP