Unlock instant, AI-driven research and patent intelligence for your innovation.

Adhesive film for wafer support for processing wafer of semiconductor thin film

An adhesive film and semiconductor technology, which is applied in the direction of film/sheet adhesive, semiconductor device, semiconductor/solid device manufacturing, etc., can solve the problems of reduced wafer productivity, high cost, surface contamination of wafer circuit, etc., to prevent Effect of damage and pollution prevention

Inactive Publication Date: 2013-08-14
TORAY ADVANCED MATERIALS KOREA
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, washing circuit surfaces with solvents may lead to contamination of the wafer circuit surfaces
Since there are many processes like this, it takes a high cost and the productivity of wafers decreases

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adhesive film for wafer support for processing wafer of semiconductor thin film
  • Adhesive film for wafer support for processing wafer of semiconductor thin film
  • Adhesive film for wafer support for processing wafer of semiconductor thin film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] First, 66.7 parts by weight of ethyl acetate (EA) was added per 100 parts by weight of an acrylic copolymer adhesive having a molecular weight of about 1,500,000 and having a hydroxyl group on its side chain, and stirred for 1 hour. Then, 6 parts by weight of phenyl novolac acrylate as an energy beam curable acrylic oligomer was added, stirred for 1 hour; and 0.4 parts by weight of an organic acid-based curing accelerator was added, and stirred for another hour. Finally, 0.2 parts by weight of diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide as a photoinitiator was added and stirred for 1 hour to obtain an energy beam curable adhesive composition. The adhesive composition was coated on a polyimide film (Toray Dufone Corporation, 500V) having a thickness of 125 μm, and dried at 130° C. for 3 minutes, followed by energy beam curing. Thereafter, the film having the adhesive composition coated thereon was attached to a release film (Toraysaehan Co., XD5BR) having a thickness...

Embodiment 2

[0058] In the same manner as in Example 1, an adhesive film having an adhesive layer of 50 μm was obtained.

Embodiment 3

[0072] The same procedure as in Example 2 was used to obtain an adhesive film except that the heat-resistant substrate was changed to a polyimide film (KNEKA, 225AH) having a thickness of 225 μm.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
adhesion strengthaaaaaaaaaa
Login to View More

Abstract

The present invention relates to an adhesive film for a wafer support for processing a wafer of a semiconductor thin film. More particularly, the present invention relates to an adhesive film for a wafer support for processing a wafer of a semiconductor thin film which eliminates the necessity of an attachment apparatus in a film-thinning process for a semiconductor wafer, can be used regardless of the semiconductor wafer size, prevents the ingress of grinding water by coating an acrylic adhesive layer onto a heat resistant base, and leaves no adhesive layer on a circuit surface during a delamination process and thus eliminates the necessity of an additional cleaning process, thereby preventing damage to the semiconductor wafer and the contamination of the circuit surface which might occur during a complicated process. To this end, the adhesive film for a wafer support for processing a wafer of a semiconductor thin film according to the present invention comprises a heat-resistant base and a heat-resistant adhesive layer coated on the heat-resistant base, wherein said heat-resistant adhesive layer comprises an acrylic copolymer having a molecular weight of 500,000 to 3,000,000, an energy ray-curable acrylic oligomer, and a photoinitiator.

Description

technical field [0001] The present invention generally relates to a wafer supporting adhesive film for use in the manufacture of semiconductor thin film wafers, and more particularly, the present invention relates to a wafer supporting adhesive film for use in the manufacture of semiconductor thin film wafers which are reduced in thickness from the film of the semiconductor wafer. No separate bonding device is required during the thin process, the wafer supporting adhesive film is not subject to any restrictions on the size of the semiconductor wafer, it prevents the penetration of grinding water by coating an acrylic adhesive layer on a heat-resistant substrate, it No adhesive layer is left on the circuit surface during peeling and thus no additional washing process is required, thereby preventing damage in the semiconductor wafer and contamination of the circuit surface that may occur during complex processes. Background technique [0002] Since it is now required to make ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/302H01L21/304H01L21/78
CPCH01L21/6836C09J7/0264H01L2221/68327H01L21/6835C09J2203/326C09J2433/00C09J7/22H01L21/30H01L21/302H01L21/78
Inventor 朴允敏全海尚文基祯沈昌勋崔城焕
Owner TORAY ADVANCED MATERIALS KOREA