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Preparation method of low-density fiberboards

A fiberboard and low-density technology, which is applied in the field of low-density fiberboard preparation, can solve the problems that furniture boards or load-bearing boards cannot be used, performance indicators cannot be reached, and nail-holding force is poor, so as to reduce manpower consumption and transportation costs. The effect of short pressing time and light weight

Active Publication Date: 2013-02-06
FUJIAN YONGAN FORESTRY GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The performance index of this kind of low-density fiberboard does not meet the performance requirements of the furniture-type MDF used in the dry state in the national standard for medium-density fiberboard (GB / T 11718-2009), which is characterized by softness and poor nail holding power. , mainly used in door cores of wooden doors, core materials of partition walls, sound-absorbing and sound-insulating materials, etc., and cannot be used as furniture boards or load-bearing boards

Method used

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  • Preparation method of low-density fiberboards
  • Preparation method of low-density fiberboards
  • Preparation method of low-density fiberboards

Examples

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Effect test

Embodiment 1

[0012] A preparation method for low-density fiberboards, comprising steps of wood chipping, fiber preparation, fiber sizing, paving, pre-pressing, heat pressing, and wool board treatment steps, in the fiber sizing step, the weight ratio of fiber and adhesive is 10:2, that is, adding 2 parts of adhesive for every 10 parts of fiber by weight, said adhesive is composed of 90% by weight of melamine-modified urea-formaldehyde resin adhesive and 10% of melamine-formaldehyde resin adhesive, and said melamine-modified The molar ratio of formaldehyde to urea in the urea-formaldehyde resin adhesive is 1.2:1, and the weight ratio of melamine to formaldehyde in the melamine-formaldehyde resin adhesive is 0.9:1; the process parameters in the hot-pressing step are: the hot-pressing temperature is 150-210°C , the closing time of the hot press is 3 seconds, the hot pressing time is 60 seconds, the hot pressing pressure is 0-2.8 MPa, and the hot pressing coefficient is 6 seconds / mm. After test...

Embodiment 2

[0015] A preparation method for low-density fiberboards, comprising steps of wood chipping, fiber preparation, fiber sizing, paving, pre-pressing, heat pressing, and wool board treatment steps, in the fiber sizing step, the weight ratio of fiber and adhesive is 10:1.2, that is, adding 1.2 parts of adhesive per 10 parts of fiber by weight, said adhesive is composed of 99% by weight of melamine-modified urea-formaldehyde resin adhesive and 1% of melamine-formaldehyde resin adhesive, said melamine-modified The molar ratio of formaldehyde to urea in the urea-formaldehyde resin adhesive is 1.2:1, and the weight ratio of melamine to formaldehyde in the melamine-formaldehyde resin adhesive is 0.9:1; the process parameters in the hot-pressing process are: the hot-pressing temperature is 160-210°C , the closing time of the hot press is 8 seconds, the hot pressing time is 100 seconds, the hot pressing pressure is 0-2.8 MPa, and the hot pressing coefficient is 10 seconds / mm. After testin...

Embodiment 3

[0018] A preparation method for low-density fiberboards, comprising steps of wood chipping, fiber preparation, fiber sizing, paving, pre-pressing, heat pressing, and wool board treatment steps, in the fiber sizing step, the weight ratio of fiber and adhesive is 10:1.5, that is, adding 1.5 parts of adhesive per 10 parts of fiber by weight, said adhesive is composed of 95% by weight of melamine-modified urea-formaldehyde resin adhesive and 5% of melamine-formaldehyde resin adhesive, said melamine-modified The molar ratio of formaldehyde to urea in the urea-formaldehyde resin adhesive is 1.2:1, and the weight ratio of melamine to formaldehyde in the melamine-formaldehyde resin adhesive is 0.9:1; the process parameters in the hot-pressing process are: the hot-pressing temperature is 170-210°C , the closing time of the hot press is 6 seconds, the hot pressing time is 90 seconds, the hot pressing pressure is 0-2.8 MPa, and the hot pressing coefficient is 9 seconds / mm. After testing,...

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Abstract

The invention discloses a preparation method of low-density fiberboards, which comprises the steps of timber chipping, fiber preparation, fiber sizing, pavement, prepressing, hot pressing, and treatment of rough boards, wherein the ratio of fibers to adhesives is 10:1.2-2 in parts by weight in the step of fiber sizing, and the adhesives are prepared by mixing 90-99wt% of melamine-modified urea resin adhesive and 1-10wt% of melamine-formaldehyde resin adhesive, the mole ratio of formaldehyde to urea in the melamine-modified urea resin adhesive is 1.2:1, and the weight ratio of melamine to formaldehyde in the melamine-formaldehyde resin adhesive is 0.9:1. Low-density fiberboards with density of 450-650kg / m<3>, prepared with the method, can be used as furniture boards or loading boards. Because the low-density fiberboards have lower density than that of furniture type medium-density fiberboards, fewer timbers are consumed in production, and a great number of timber resources can be saved.

Description

technical field [0001] The invention relates to a method for preparing a fiberboard, in particular to a method for preparing a low-density fiberboard. Background technique [0002] Fiberboard is a kind of man-made board made of wood fiber or other plant fiber as the main raw material, which is prepared by fiber, adhesive is applied, and the fiber is dried and then hot-pressed. Classified by bulk density, fiberboard can be divided into high-density fiberboard, medium-density fiberboard, and low-density fiberboard. [0003] The low-density fiberboard currently on the market is usually prepared by a medium-density fiberboard production line. For example, in a Chinese patent application with the publication number CN101229649A and the title of invention "a low-density fiberboard and its preparation method", a low-density fiberboard is disclosed. A method for preparing fiberboard, comprising steps such as wood chipping, fiber preparation, fiber sizing, fiber laying, pre-pressing...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B27N3/04B27N1/02B27N3/08
Inventor 吴景贤林青吴祖顺陈建新叶新强王永闽
Owner FUJIAN YONGAN FORESTRY GRP CO LTD
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