High-pixel photographic module and burning method for chip

Abstract

The invention discloses a high-pixel photographic module, which comprises an optical detection element, a programmable chip and a circuit board for fixing the optical detection element and the programmable chip. The high-pixel photographic module is characterized in that: the programmable chip is a one-time programmable chip; moreover, the photosensitive optical detection element is integrated with the chip; a camera consistence compensation parameter of the optical detection element is burnt in the chip; and mobile phone software reads the parameter by a preset format so as to correct the optical accuracy of the optical detection element. Compared with the conventional high-pixel photographic module structure, the invention reduces the size of the whole module, widens the application range of the module, simultaneously can increase the yield and improve the production efficiency in module batch production, shortens the time and achieves technical advantages and good technical effects. In addition, the invention also discloses a burning method for the chip of the high-pixel photographic module.

Description

technical field [0001] The solution belongs to the field of optoelectronics and relates to a high-pixel camera module. At the same time, the invention also relates to a method for burning a one-time programmable chip integrated on an optical detection element of the module. Background technique [0002] With the development of mobile phone technology, the application of camera modules has been greatly promoted. [0003] The structure of the current high-pixel camera module mainly includes a circuit board with an optical detection element (sensor) and an electrically erasable programmable read-only memory (EEPROM) provided with various parameters of the optical detection element. If the addressing mode of the above parameters is set internally, the optical detection element can be adjusted more accurately by software, so as to obtain a better camera effect. [0004] figure 1 It is a structural schematic diagram of a high-pixel camera module in the prior art. [0005] As sh...

AI Technical Summary

Problems solved by technology

[0008] First, due to the addition of an electrically erasable programmable read-only memory, the production cost is actually increased, and at the same time, due to the addition of a step process, the production yield and production efficiency are reduced;

[0009] Secondly, because the above-mentioned EEPROM itself has a read / write pin to control it, since we need to keep the EEPROM in the writing state, so the During operation, there is a danger that the data in the EEPROM may be erased

[0010] In addition, since the EEPROM itself has a certain space, if the customer needs to adopt the socket solution, the EEPROM cannot be placed in it;

[0011] Moreover, due to the relatively small size of the EEPROM, it is very difficult to repair or replace, so some components of this module may be scrapped or the entire module may be scrapped directly

[0012] These shortcomings make the high-pixel camera module adopting the scheme of electrically erasable programmable read-only memory hinder its large-scale promotion and use to a certain extent.

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