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Manufacturing process of low-power TOP LED (light-emitting diode) support, and product and LED module thereof

A technology of LED bracket and manufacturing process, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of low-power TOPLED bracket heat dissipation requirements, waste of cost, etc., and achieve the effect of low cost, low cost, and low process cost

Inactive Publication Date: 2011-08-24
SHENZHEN REFOND OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, the heat dissipation requirements of low-power TOP LED brackets are not as harsh as the industry claims. Using copper as the substrate is completely overkill and wastes cost.

Method used

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  • Manufacturing process of low-power TOP LED (light-emitting diode) support, and product and LED module thereof
  • Manufacturing process of low-power TOP LED (light-emitting diode) support, and product and LED module thereof
  • Manufacturing process of low-power TOP LED (light-emitting diode) support, and product and LED module thereof

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Embodiment approach

[0036] Further, please refer to FIG. 1 , as an embodiment of the manufacturing process of the low-power TOP LED bracket provided by the present invention, the first step also includes drilling a second through hole 110 for positioning, and the second through hole 110 The aperture of the first through hole 120 is controlled between 1.4-1.6 mm, and the aperture of the first through hole 120 is controlled between 0.78-0.82 mm. The purpose of drilling the second through hole 110 for positioning is that this hole can be used as a design reference, which can be used as a reference in subsequent processes such as electroplating, injection molding, die bonding, wire bonding, and sealing to avoid large errors; the aperture The size must be appropriate, especially the diameter of the first through hole 120 is directly related to the mechanical strength of the substrate. According to tests, the diameter of the first through hole 120 is preferably controlled between 0.78 mm and 0.82 mm.

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Abstract

The invention is applicable to the field of LED (light-emitting diode) production technologies and provides a manufacturing process of a low-power TOP LED support, which comprises the following steps: step 1) performing plate cutting on an epoxy insulating plate and drilling a first through hole; step 2) dividing a plurality of electroplating regions on the main surface and the back surface of the epoxy insulating plate, performing electroplating on the electroplating regions, and forming gaps between the electroplating regions on the main surface after completing electroplating; and step 3) dividing an injection molding region on the main surface of the epoxy insulating plate, and performing injection molding of a plastic reflecting cup on the injection molding region. The invention further provides the TOP LED support, and the support is manufactured by the manufacturing process. The invention further provides an LED module, and the support adopted by the LED module is the low-power TOP LED support provided by the invention. As for the manufacturing process of the low-power TOP LED support and a product and the LED module thereof, the processing difficulty is small, and the production cost is low.

Description

technical field [0001] The invention belongs to the technical field of LED production, and more specifically relates to a manufacturing process of a low-power TOP LED bracket, its product and an LED module. Background technique [0002] TOP LED refers to the LED that emits light from the top surface and the plane, that is, the surface of the LED is not semicircular, but flat. The low-power TOP LED bracket is the substrate of the LED lamp bead before packaging, which plays the role of protecting the die-bonding wire and silicone molding, and finally controls the light output effect. Die-bonding wires are bonded on the LED bracket, and then encapsulated with encapsulant. The structure and size of the LED bracket cup have a certain influence on the luminous intensity and luminous angle, and its electrical conductivity and heat dissipation have a direct relationship with the optical properties and service life of the LED. [0003] At present, the base material of the low-power...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/48H01L33/64H01L25/075C25D5/02C25D5/10C25D7/00
Inventor 罗锦长
Owner SHENZHEN REFOND OPTOELECTRONICS
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