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Inorganic adhesive used for slurry, and preparation method thereof

A technology of inorganic bonding and adhesives, applied in the chemical industry, can solve the problems of hidden toxicity, great health hazards, slow lead poisoning, etc., and achieve the effect of wide application range, wide performance adjustment range, and good sealing performance

Inactive Publication Date: 2011-09-21
李胜春
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing low-melting glass for electronic paste contains a large amount of heavy metal lead. Lead is one of the six metals used by humans at the earliest. It is harmful to human health and can accumulate in the body to cause lead poisoning. The role of lead poisoning Rather slow and stealthy, it is not easy to detect until the toxicity is manifested

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] 1. The raw material composition is by weight percentage:

[0057] SiO 2 28%, Al 2 o 3 12%, CaO 21%, B 2 o 3 12%, BaO 13%, ZnO 3%, V 2 o 5 4%, CuO 2%, Li 2 O is 3.5%, Sb 2 o 3 1%, Co 3 o 4 0.5%.

[0058] 2. Preparation method:

[0059] (1) take each raw material according to the weight percentage of each component;

[0060] (2) Fully mix the raw materials taken;

[0061] (3) Put the mixed mixture into a crucible, then put it into an electric furnace with a furnace temperature of 1400° C., keep it warm for 4 hours, stir once every 1 hour during the heat preservation stage, and stir for 5 minutes each time;

[0062] (4) Pour the melted glass liquid into a tablet press and press into thin slices or pour into cold water to quench;

[0063] (5) Put flake or granular glass into a ball mill for ball milling;

[0064] (6) Sieve, test and pack the ball-milled glass powder.

[0065] 3. Test results:

[0066] Expansion coefficient: 88.5×10 -7 / °C(300°C)

[0067]...

Embodiment 2

[0070] 1. The raw material composition is by weight percentage:

[0071] SiO 2 21%, Al 2 o 3 17%, CaO 26%, B 2 o 3 18%, BaO 9%, ZnO 2%, V 2 o 5 3%, CuO 1%, Li 2 O is 2%, Sb 2 o 3 0.7%, Co 3 o 4 0.3%.

[0072] 2. Preparation method:

[0073] (1) take each raw material according to the weight percentage of each component;

[0074] (2) Fully mix the raw materials taken;

[0075] (3) Put the mixed mixture into a crucible, then put it into an electric furnace with a furnace temperature of 1350° C., keep it warm for 3 hours, stir once every 1 hour during the heat preservation stage, and stir for 5 minutes each time;

[0076] (4) Pour the melted glass liquid into a tablet press and press into thin slices or pour into cold water to quench;

[0077] (5) Put flake or granular glass into a ball mill for ball milling;

[0078] (6) Sieve, test and pack the ball-milled glass powder.

[0079] 3. Test results:

[0080] Expansion coefficient: 90.4×10 -7 / °C(300°C)

[0081] ...

Embodiment 3

[0084] 1. The raw material composition is by weight percentage:

[0085] SiO 2 31%, Al 2 o 3 16%, CaO 22%, B 2 o 3 9%, BaO 13%, ZnO 2%, V 2 o 5 2%, CuO 3%, Li 2 O is 2%, Sb 2 o 3 0.6%, Co 3 o 4 0.4%.

[0086] 2. Preparation method:

[0087] (1) take each raw material according to the weight percentage of each component;

[0088] (2) Fully mix the raw materials taken;

[0089] (3) Put the mixed mixture into a crucible, then put it into an electric furnace with a furnace temperature of 1400 ° C, keep it warm for 3 hours, stir once every 1 hour during the heat preservation stage, and stir for 5 minutes each time;

[0090] (4) Pour the melted glass liquid into a tablet press and press into thin slices or pour into cold water to quench;

[0091] (5) Put flake or granular glass into a ball mill for ball milling;

[0092] (6) Sieve, test and pack the ball-milled glass powder.

[0093] 3. Test results:

[0094] Expansion coefficient: 87.0×10 -7 / °C(300°C)

[0095] ...

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Abstract

The invention relates to an inorganic adhesive used for slurry, and a preparation method thereof. The inorganic adhesive is composed of the following raw materials in percentage by weight: 20-40% of SiO2, 5-20% of Al2O3, 5-30% of CaO, 1-20% of B2O3, 1-20% of BaO, 1-10% of ZnO, 1-10% of V2O5, 0.1-5% of CuO, 0.1-5% of Li2O, 0.1-2% of Sb2O3 and 0.1-1% of Co3O4. The preparation method comprises the following processes: weighing, mixing materials, melting, tabletting, ball-milling and screening. The inorganic adhesive has the advantages of complete removal of gas, high airtightness, and high adhesive force.

Description

【Technical field】 [0001] The invention belongs to the technical field of chemical industry, and in particular relates to an inorganic binder for slurry and a preparation method thereof. 【Background technique】 [0002] Conductive paste is a new type of electronic functional material, which is widely used in the electronic industry. The conductive paste with carbon as the conductive filler is mainly used to make printed resistors on the wiring board of printed circuit boards, printed resistors mixed with thick films, and keyboard switches. There is a big gap between my country's conductive paste and foreign countries, mainly due to the lack of varieties and low output, and no compatible serialized products have been formed. At present, my country has a relatively high level of research and development of conductive pastes that can be commercialized. Due to the differences in performance and process properties such as sintering temperature and curing time, their wide applicati...

Claims

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Application Information

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IPC IPC(8): C03C12/00
Inventor 李胜春武荣丽刘立起
Owner 李胜春
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