Light-emitting diode (LED) multi-chip integrated packaging device

Abstract

The invention discloses a light-emitting diode (LED) multi-chip integrated packaging device, which comprises a substrate [1] and a plurality of chips [6], and is characterized by also comprising a silicon chip [3], a fluorescent powder layer [4] and an optical silica gel lens [5], wherein a gold-plating layer is plated at the bottom of the silicon chip [3]; the plurality of chips [6] are welded on the silicon chip [3] in parallel and in series so as to form a serial/parallel circuit; the substrate [1] is a red copper plate; a square groove is formed on the substrate [1]; nickel silver is electroplated at the bottom of the square groove; the silicon chip [3] is positioned in the square groove; an alloy soldering lug [2] is arranged between the silicon chip [3] and the bottom of the square groove, so that the silicon chip [3] is fixed in the square groove; the fluorescent powder layer [4] is filled in and covers the silicon chip [3] and a convex surface is formed on an upper surface of the fluorescent powder layer [4]; and the silica gel lens [5] is hemispherically fixed on the substrate [1] and covers the fluorescent powder layer [4]. The LED multi-chip integrated packaging device has the advantages of high reliability, high luminous efficiency and long service life.

Description

technical field [0001] The invention relates to an LED multi-chip integrated packaging device. Background technique [0002] Existing LED multi-chip integrated packaging devices mostly use multiple small chips or multiple large chips to be integrated in series and parallel; the substrate mostly uses an aluminum-based circuit board; the chip and the substrate are bonded with silver glue; In the way of circular grooves, yellow fluorescent glue is filled in the middle to form white light. For most of the current packaging forms of LED integrated packaging devices, the LED devices have disadvantages such as large packaging thermal resistance, reduced reliability, low luminous efficiency, difficult secondary heat dissipation treatment of the device, and reduced lifespan. Contents of the invention [0003] The purpose of the present invention is to solve the problems of large thermal resistance, low reliability, low luminous efficiency, difficult secondary heat dissipation trea...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problems of large thermal resistance, low reliability, low luminous efficiency, difficult secondary heat dissipation treatment of the device, and reduced service life of the existing LED multi-chip integrated packaging device.

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