Composition for copper-clad laminate with low dielectric constant and copper-clad laminate manufactured by using same

Abstract

The invention relates to a composition for a copper-clad laminate with a low dielectric constant and the copper-clad laminate manufactured by using the same. The composition for the copper-clad laminate with the low dielectric constant comprises the following components in parts by weight: thermosetting resin, 1-30 parts of hollow filler, 1-50 parts of low water absorption filler and 0.5-5 parts of treating agent, wherein the treating agent comprises a silane coupling agent, a titanate coupling agent or a long-chain organic silicon treating agent. The copper-clad laminate manufactured by using the composition comprises a plurality of superimposed presoaking bodies and a copper foil covering one or two sides of the plurality of superimposed presoaking bodies, wherein each presoaking body comprises a base material and the composition which is soaked and dried and is attached to the base material for the copper-clad laminate with the low dielectric constant. By using the method, an interface of the hollow filler and the resin can be improved by using the hollow filler to cooperate with the low water absorption filler and the special treating agent, so that the water absorption of plate materials is reduced, and the copper-clad laminate with the reduced dielectric constant can be obtained.

Description

technical field [0001] The invention relates to a composition, in particular to a composition for a low dielectric constant copper clad laminate and a low dielectric constant copper clad laminate made using the composition. Background technique [0002] The development of modern high-frequency communication puts forward higher and higher requirements on the electrical properties of materials, especially low dielectric constant laminates for high frequency. Generally speaking, the effective dielectric constant of the composite material can be approximated as the weighted sum of the dielectric constant of each component and its volume fraction occupied in the composite material. Since most of the volume of the hollow filler is air (dielectric constant 1.2-2.0), it has a lower dielectric constant. There are many studies on hollow fillers in composite materials, among which the relevant patents of hollow fillers in copper clad laminates are as follows: Polyclad’s patent US56702...

AI Technical Summary

Problems solved by technology

[0003] However, there are not many specific applications of hollow fillers. One of the important reasons is that the interface between hollow fillers and resins is poor. Since hollow fillers have no groups on the surface that can react with resins, the bonding force with resins is not good, and the interface is relatively large.

These interfaces are easy to absorb water in a humid environment, which increases the water absorption rate of the board. When the board passes through the assembly process of a circuit board in a high-temperature environment, the water evaporates into water vapor to generate a huge vapor pressure, resulting in stratification of the board. , Explosion problem

At the same time, since water is a strong polar substance, the increase of the water absorption rate of the sheet will also cause the increase of the dielectric constant of the sheet.