Supercritical water jet cleaning equipment

A technology for supercritical water and cleaning equipment, which is applied in cleaning methods and utensils, cleaning methods using liquids, chemical instruments and methods, etc. Effects of uniformity, improved cleaning repeatability and wafer-to- wafer uniformity

Active Publication Date: 2011-10-12
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of this, the main purpose of the present invention is to provide a supercritical water jet cleaning equipment, to overcome the difficultie

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[0032] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following is a specific example in conjunction with the removal of photoresist on the surface of the silicon wafer, and the present invention is further described in detail with reference to the accompanying drawings.

[0033] Such as figure 1 As shown, figure 1 It is a schematic diagram of the structure of the supercritical water jet cleaning equipment provided by the present invention. The equipment includes a supercritical water jet generating device 1, a cleaning chamber 2 and a cleaning product recovery processing device 3, wherein the supercritical water in the supercritical water jet generating device 1 It reaches the silicon wafer in the cleaning chamber 2 in the form of a jet, and forms a supercritical water constant temperature and pressure microenvironment on the surface of the silicon wafer. Using the physical and chemical properties of supercritical water...

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Abstract

The invention discloses supercritical water jet cleaning equipment used for carrying out lossless cleaning on a silicon wafer. The equipment comprises a supercritical water jet generating device, a cleaning chamber and a cleaning product recycling device. In the invention, the supercritical water reaches the silicon wafer in a jet form, a supercritical water constant-temperature constant-pressuremicro environment is formed on the surface of the silicon wafer, and the physical and chemical properties of the supercritical water are utilized to carry out lossless cleaning on the surface of the silicon wafer. By utilizing the equipment disclosed by the invention, fine structures on the surface of the silicon surface can be effectively cleaned, and the application of a high-pressure cleaning cavity can be avoided.

Description

technical field [0001] The invention relates to the technical field of silicon chip cleaning in semiconductor manufacturing technology, in particular to a supercritical water jet cleaning device, which utilizes the physical and chemical properties of supercritical water to effectively clean semiconductor silicon chips. Background technique [0002] As semiconductor technology continues to expand to smaller technology nodes, silicon wafer cleaning technology is constantly being challenged. Cleaning accounts for more than one-third of the entire semiconductor manufacturing process. Traditional cleaning technology not only consumes a lot of pure water and chemical reagents, but also the cleaning power is increasingly unable to meet the requirements of new technologies. [0003] The supercritical cleaning process represented by supercritical carbon dioxide and supercritical water has shown excellent application prospects in the semiconductor industry in terms of degumming, meta...

Claims

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Application Information

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IPC IPC(8): B08B3/08
Inventor 高超群景玉鹏
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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