Illumination structure

Abstract

The invention relates to an illumination structure. A light-emitting diode (LED) chip is arranged in a lamp holder radiating module and is an LED bare chip without fluorescent powder or sealant; a lamp shade covers the upper side of the LED chip of the lamp holder radiating module; the inner wall of the lamp shade is uniformly coated with a fluorescent coating; a space is reserved between the LED chip and the fluorescent coating; and the fluorescent coating absorbs light rays emitted by the LED chip to emit illumination white light. Therefore, the problem that the lighting effect of the fluorescent powder on the conventional LED chip is attenuated is solved, and yield and economic benefits can be improved.

Description

technical field [0001] The invention relates to an illumination structure, which refers to a design of making an illumination structure body in a non-contact manner between a bare chip of a light-emitting diode and phosphor powder. Background technique [0002] The application of light-emitting diodes (LEDs) has been very extensive and has gradually become more diversified. The basic structure of LEDs currently used in lighting, such as image 3 As shown, it is the first kind of existing structure, mainly a chip is arranged in an enclosed outer package (outer package), and a fluorescent compound glue is sealed on the surface of the chip, and the inside of the fluorescent compound glue is Contains: basic colloid (generally silica gel), fluorescent powder, activator, etc. The fluorescent mixed glue is sealed above the outer seal and is in direct or indirect contact with the chip, so when the chip emits light, The light passes through the protective lens and reacts with the flu...

AI Technical Summary

Problems solved by technology

[0004] Because high-power LEDs (for example: LEDs for lighting) emit extremely high heat, the heat emitted by the chip will be directly conducted to the fluorescent mixed glue, making the basic colloid (usually silica gel), phosphor, and activated The phosphor is baked under high heat for a long time, which makes the phosphor easy to deteriorate and deteriorate due to the high temperature generated by the LED, and at the same time produces the phenomenon of light decay, while the fluorescent mixed glue is prone to brittle cracking for a long time, which is the most common problem in existing LEDs. shortcoming

[0005] Secondly, in order to slow down the impact of the above-mentioned high-power LED's high heat on the fluorescent mixture and phosphor, it is necessary to develop and use high-temperature-resistant phosphors and colloids, which keeps the cost of LEDs high, which is another existing disadvantage.

[0006] After the LED is installed on the chip, it is coated and sealed on the chip with a mixed colloid containing fluorescent powder and combined as a whole. Therefore, after the LED is coated with phosphor, optical testing needs to be carried out again. Once the light saturation is deviated or the color is distorted, it will be discarded together with the excellent outer seal and the chip, so that the pass rate cannot be improved and the cost cannot be reduced. Effective control is another existing shortcoming

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