Flexible printed circuit (FPC) hollowed board and manufacturing method thereof

A manufacturing method and technology of hollow boards, applied in the field of hollow boards, can solve the problems of easy wrinkling of FPC hollow boards, low yield rate, and easy damage to lines, so as to avoid line wrinkles and damage, good lines and yield rates, Avoid wrinkles and damage to the line

Active Publication Date: 2011-11-09
深圳市合力泰光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is to provide a kind of FPC hollow board with high yield rate that is not easy to wrinkle and has good wiring

Method used

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  • Flexible printed circuit (FPC) hollowed board and manufacturing method thereof
  • Flexible printed circuit (FPC) hollowed board and manufacturing method thereof
  • Flexible printed circuit (FPC) hollowed board and manufacturing method thereof

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Embodiment Construction

[0027] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0028] The present invention uses double-sided copper foil to make the FPC hollow board, which avoids the defects that the circuit of the FPC hollow board made of pure copper foil is easily damaged and the yield is low. see Figures 2 to 3 , figure 2 It is a schematic structural view of the front of the FPC hollow board in an embodiment of the present invention, image 3 It is a structural schematic diagram of the back of the FPC hollow board in an embodiment. The manufacturing method of the FPC hollow board provided by the present invention combines figure 2 and ...

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Abstract

The invention provides a flexible printed circuit (FPC) hollowed board and a manufacturing method thereof. The manufacturing method of the FPC hollowed board sequentially comprises the following steps of: S1, boring: boring a via hole in a double-faced copper foil, wherein the via hole is positioned in an area for manufacturing fingers of double-faced copper foil; S2, blackening the via hole and plating copper: blackening the via hole in the double-faced copper foil and plating copper; S3, manufacturing a circuit and the fingers: forming the circuit and a first finger on one surface of the double-faced copper foil and forming a second finger on the other surface of the double-faced copper foil; S4, adhering a covering film: adhering the covering film to the copper foil surface of the double-faced copper foil where the circuit is formed; and S5, punching: and punching off the base material at the first finger and the base material at the second finger to form a hollowed board. The FPC hollowed board has the advantages that the circuit is difficult to damage, the circuit is excellent and product yield is high.

Description

technical field [0001] The invention relates to a hollow board, in particular to a hollow board of a flexible printed circuit board and a manufacturing method thereof. Background technique [0002] FPC (Flexible Printed Circuit Board) is widely used in various electronic products due to its good bending properties and other advantages. Some electronic products require FPC to be a hollow board, and the FPC hollow board refers to a flexible printed circuit board that is hollowed out between the fingers on the board. The hollow fingers need to be tinned and provide a hollow mounting space so that they can be socketed on other components. The FPC hollow board not only needs to achieve good welding performance on both sides, but also needs to have a good insertion connection shape. Therefore, the FPC hollow board has very high requirements for the flatness of the suspended fingers. [0003] In order to achieve good performance of FPC hollow board welding and insertion connectio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/40H05K1/11
Inventor 谷日辉黄大林
Owner 深圳市合力泰光电有限公司
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