Light emergency interface of LED (light emitting diode) chip and preparation method thereof
A LED chip and interface technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as the decrease of light output rate, achieve the effect of large reflection angle, multiple light output, and improve light output efficiency
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[0021] A light exit interface of an LED chip comprises a light-transmitting substrate arranged on the LED chip, and a light-transmitting film with a microconvex lens array structure is arranged on the outer surface of the light-transmitting substrate.
[0022] The specific preparation method is as follows:
[0023] In order to obtain a higher refractive index not less than 2, titanium oxide (T i o 2 ) or titania and zirconia (Z r o 2 ) mixed base.
[0024] Because the purpose of preparing the optical film of the present invention is only to minimize and avoid the loss of total reflection that may occur on the interface, without any other strict requirements, therefore, the method of electron beam evaporation can be adopted by relying on a special microporous screen plate, Depositing a special optical film with a suitable thickness on the surface of the LED chip that presents a surface similar to a convex lens array, without having to use the existing complicated micro-opti...
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