LED encapsulated by ceramic substrate in integrated mode

A technology of ceramic substrate and integrated packaging, which is applied in the direction of electrical components, electric solid devices, circuits, etc., to achieve the effect of improving heat dissipation performance and reducing contact thermal resistance

Inactive Publication Date: 2011-11-16
IRICO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The problem to be solved by the present invention is to provide a ceramic substrate integrated packaged LED, which o...

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  • LED encapsulated by ceramic substrate in integrated mode
  • LED encapsulated by ceramic substrate in integrated mode
  • LED encapsulated by ceramic substrate in integrated mode

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Embodiment Construction

[0026] The present invention will be further described in detail below in conjunction with specific embodiments and drawings, which are explanations of the present invention rather than limitations.

[0027] see Figure 1 ~ Figure 3 , an LED integrated and packaged with a ceramic substrate, comprising a ceramic substrate 4, a circuit 2 and a circuit positive electrode 5 and a circuit negative electrode 6 at both ends of the circuit 2 are arranged on the metallized front of the ceramic substrate 4, and the circuit 2 is provided with a circuit for connecting the chip 1. The metal base, the chip 1 adopts a vertical structure, the chip 1 and the metal base are connected through the eutectic layer 8, the metal base is connected to an adjacent chip 1 through the connection line 3, and the phosphor colloid 7 is coated on the chip 1 superior.

[0028] figure 1 Shown are 49 chips arranged in a matrix. A fixing point 11 is also provided on the ceramic substrate 4 for easy installatio...

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Abstract

The invention discloses a light-emitting diode (LED) encapsulated by a ceramic substrate in an integrated mode, which comprises a ceramic substrate, wherein a circuit and a circuit positive electrode and a circuit negative electrode at both ends of the circuit are arranged on the metalized front side of the ceramic substrate; a metal base for connecting chips is arranged on the circuit; the chips and the metal base are connected by an eutectic layer; the metal base is connected with the adjacent chip by a connection wire; and fluorescent powder colloid is wrapped on the chips. In the LED encapsulated by the ceramic substrate in an integrated mode, thermal contact resistance is reduced by the application of the high-heat conduction ceramic substrate and the application of the eutectic technology and metalized technology, so that the radiating performance of a high-power integrated encapsulation LED light source is improved greatly.

Description

technical field [0001] The invention belongs to the technical field of LEDs and relates to an LED integrated and packaged with a ceramic substrate. Background technique [0002] So far, LED products have the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free, and environmental protection benefits. However, usually about 20% of the input power of LED high-power products can be converted into light, and the remaining 80% of the electrical energy is converted into heat energy, so heat dissipation is one of the problems that LEDs need to solve. Generally speaking, if the heat energy generated when the LED emits light cannot be exported, the junction temperature of the LED will be too high, which will affect the product life cycle, luminous efficiency, and stability. [0003] The LED surface light sources in the current market have the following problems as lighting, especially those above 50W: 1. The power used for ligh...

Claims

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Application Information

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IPC IPC(8): H01L33/64H01L33/62H01L25/075
CPCH01L2224/48091H01L2224/73265H01L2924/00014
Inventor 程治国杨威
Owner IRICO
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