Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Air conditioning plant without outdoor machine

An air-conditioning device, no outdoor unit technology, applied in the air-conditioning system, the operation mode of the machine, the refrigerator, etc., can solve the problems of slow cooling, noise, and no semiconductor refrigeration air-conditioning products.

Inactive Publication Date: 2011-11-23
上海科伟低压电器厂
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, many companies at home and abroad have been producing semiconductor refrigeration devices and devices, but they cannot be directly used in air conditioners, and there is no relevant information on air conditioners. In fact, it is necessary to use semiconductor refrigeration devices in air conditioners. Due to the problems of the power of the refrigeration device and the production process, there is currently no semiconductor refrigeration air conditioner product
[0005] Compression refrigeration air conditioners have many disadvantages, such as low efficiency, high energy consumption, slow cooling, large cooling loss, noise, unable to restart immediately after shutdown, short service life, easy to frost in winter, potential safety hazards, and many Condensed water is discharged to the outside, causing impact on the surrounding environment, the most important thing is polluting the environment
In addition to the above disadvantages, absorption refrigeration air conditioners are bulky, limited in cooling temperature, and have potential safety hazards

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Air conditioning plant without outdoor machine
  • Air conditioning plant without outdoor machine
  • Air conditioning plant without outdoor machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] According to the claims of the present invention and the contents disclosed in the summary of the invention, the technical solution of the present invention is specifically described as follows.

[0023] Please see attached figure 1 , attached figure 2 and attached image 3 As shown, the air conditioner without an outdoor unit of the present invention includes a housing 01, a semiconductor refrigeration device 02, an exchanger 03, a radiator 04 and a mounting plate (010), and the semiconductor refrigeration device 02, the exchanger 03 and the radiator 04 are respectively arranged on In the casing 01, the mounting plate 010 is fixedly connected with the casing 01, the mounting plate 010 is used for installing and fixing the air conditioner without an outdoor unit on the wall, and the exchanger 03 and the radiator 04 are arranged on both sides of the semiconductor refrigeration device 02 , the exchanger 03 is used as the refrigeration exchanger of the semiconductor ref...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an air conditioning plant without an outdoor machine, which comprises a shell, a semiconductor refrigerating apparatus, an exchanger, heat radiators and a mounting plate. The semiconductor refrigerating apparatus, the exchanger and a pair of heat radiators are respectively arranged in the shell; the mounting plate is fixedly connected with the shell and is used for installing and fixing the air conditioning plant without the outdoor machine on a wall; the exchanger and the heat radiators are arranged at two sides of the semiconductor refrigerating apparatus; the exchanger is used as a refrigerating exchanger of the semiconductor refrigerating apparatus for conducting cold quantity of the semiconductor refrigerating apparatus; and the heat radiators are used for radiating the heat of the semiconductor refrigerating apparatus so as to replace the heat quantity which is produced when the semiconductor refrigerating apparatus works. The air conditioning plant without the outdoor machine disclosed by the invention has the advantages of light weight, small volume, high efficiency, high refrigerating speed, quick start, long service life, no outdoor machine, no need of maintenance, no noise, large cold-heat temperature difference, convenience and flexibility for control and no pollution for ambient environments.

Description

technical field [0001] The invention relates to an air conditioner, in particular to an air conditioner without an outdoor unit. Background technique [0002] At present, the air conditioner products commonly used in various countries in the world, small and medium-sized air conditioners are refrigerated by compression refrigeration, and some large air conditioners are refrigerated by absorption refrigeration technology, but these two methods are used for refrigeration. There are many shortcomings, but according to the current material technology development achievements, it is possible to make an air conditioner without an outdoor unit. Because a solid-state device "semiconductor refrigeration device" is used, the efficiency is high; the refrigeration efficiency can reach more than 96%, and the system The thermal efficiency can reach 100%; no pollution, real zero emission; no noise; no maintenance; no outdoor unit of ordinary split air conditioner, easy and convenient insta...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): F24F5/00F25B21/02F24F13/20F24F13/28F24F11/02
Inventor 吴荣钢
Owner 上海科伟低压电器厂
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products