Display panel module assembly device

A technology for display panels and assembly devices, which can be used in transportation and packaging, furnaces, electrical components, etc., and can solve problems such as the overall length of the device

Inactive Publication Date: 2011-11-30
HITACHI HIGH-TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the overall length of the general di

Method used

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Examples

Experimental program
Comparison scheme
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Example Embodiment

[0126] [Example 1]

[0127] First, the assembly process of the display panel module will be briefly described. Figure 13 It is a diagram for explaining the assembly process of the display panel module. The assembly of the display panel module is carried out as follows.

[0128] (a) Terminal cleaning step: a step of cleaning the peripheral terminal area of ​​the display panel substrate 7. Wipe and remove (45) foreign matter from the terminal portion with a cleaning tape 44 immersed in a solvent or the like. As other foreign matter removal methods, methods using UV and plasma are sometimes used.

[0129] (b) ACF pasting step (panel side): a step of pasting an anisotropic conductive film (ACF) on the display panel substrate 7. The ACF 46 is softened and temporarily attached (47) to the device mounting position of the display panel substrate 7 at a temperature ranging from a few tens of degrees or less to about 100 degrees Celsius.

[0130] (c) Mounting process: A process of mounting ...

Example Embodiment

[0217] [Example 2]

[0218] Next, Example 2 will be described.

[0219] Figure 14 It is an example for explaining the structure of a panel assembly device for panel assembly using a conventional transport method and a panel transport path. The figure shows the state of viewing the entire panel assembly device from obliquely above, and the panels are transported and assembled between the units divided in the figure. The process is as follows.

[0220] (1) The process of cleaning the device mounting part of the edge part (electrode part) of the display panel

[0221] (2) The process of sticking an anisotropic conductive film (ACF: Anisotropic Conductive Film) on the edge of the display panel after cleaning

[0222] (3) The process of positioning and mounting TAB and IC with high accuracy at the position where the ACF is pasted

[0223] (4) The process of heating and pressing the mounted TAB and IC and bonding with the previous ACF film

[0224] (5) The process of checking the position an...

Example Embodiment

[0242] [Example 3]

[0243] in Figure 16 as well as Figure 17 In the plan view, when the panel is moved into the panel edge processing unit 600 arranged in the shape of "コ", the panel that has finished edge processing remains in the panel edge processing unit 600; or when the panel that has finished edge processing is moved out If there are display panels to be newly imported from upstream, sometimes it is necessary to try to solve the collision of the panels, or to set a standby time on the side to be newly imported. In this case, even if the length of the device is shortened, the assembly time cannot be shortened due to the feature that can be achieved by the above-mentioned three-sided simultaneous processing. In addition, the panel may be damaged, which may cause problems such as low reliability. Therefore, next, as Example 3, the above-described Figure 16 as well as Figure 17 The methods for solving problems such as the possibility of collision between panels and ensurin...

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Abstract

PURPOSE: A display panel module assembling device is provided to control a plurality of processing sides suitable for the size of each display panel substrate. CONSTITUTION: A processing panel maintenance unit(4) maintains a first display panel substrate and includes a processing unit. A first processing unit is arranged about the first processing side of the first display panel substrate. A second processing unit is arranged about the first processing unit. A third processing unit faces a second processing unit.

Description

technical field [0001] The invention relates to a mounting device for mounting electronic devices on a substrate, a heating and pressure welding device for heating and pressure-bonding electronic devices on a substrate, and a display panel module assembly device for processing a substrate and assembling a display panel. [0002] For example, it involves mounting driver ICs around display panel substrates (display element substrates) of FPD (Flat Panel Display) such as liquid crystal and plasma, and connecting so-called TAB (Tape) such as COF (Chip on Film) and FPC (Flexible Printed Circuits). Automated Bonding) and a display panel module assembly device for mounting peripheral substrates (PCB: Printed Circuit Board). [0003] More specifically, it relates to the configuration of a small, high-efficiency, and high-precision display panel module assembly device. Background technique [0004] The display panel module assembly device is a device that performs multiple processin...

Claims

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Application Information

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IPC IPC(8): H01L21/677H01L21/50H01L21/60B65G49/06
Inventor 宫坂彻油田国夫斧城淳杉崎真二渡边丰山崎不二夫
Owner HITACHI HIGH-TECH CORP
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