Radiation substrate for power LED and power LED product and manufacturing method thereof
A technology of a heat dissipation substrate and a manufacturing method, which is applied in the directions of electrical components, electric solid devices, circuits, etc., can solve the problems of high process requirements for power LED heat dissipation substrates, inconvenient product testing, use and installation, poor heat dissipation effect, etc., and achieves easy detection. and mounting applications, low cost, good heat dissipation effect
Active Publication Date: 2013-08-21
FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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Problems solved by technology
[0009] The purpose of the present invention is to overcome the defects of the above-mentioned existing power LED heat dissipation substrate and its manufacturing method and products of power LED, especially the manufacturing method and product defects of high-power LED, that is, the manufacturing method of power LED heat dissipation substrate has high process requirements , complex process, low production efficiency, high cost, poor heat dissipation, and its power LED products also have problems of high product cost, poor consistency, poor reliability, product testing and inconvenient use and installation, so as to provide a circuit Manufacturing method of heat dissipation substrate with substrate mounted heat sink, power LED manufacturing method based on the heat dissipation substrate, and products manufactured by the method of the present invention
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Embodiment 4
[0094] Embodiment 4 is the second preferred embodiment of the power LED product manufacturing method based on the heat dissipation substrate described in Embodiment 1 and Embodiment 2. Figure 7 , attached Figure 8 , attached Figure 9 , attached Figure 10 , attached Figure 11 , attached Figure 12 , attached Figure 13 As shown, this embodiment is further described.
[0095] In this embodiment, a power LED manufacturing method based on the heat dissipation substrate of the present invention is disclosed, which is especially suitable for high-temperature die-bonding situations where the temperature is higher than 260°C. The method includes: (S801) substrate processing and heat sink manufacturing, (S802) chip bonding, (S803) heat sink assembly, (S804) gold wire bonding, (S805) encapsulation colloid molding and encapsulation, (S806) two Secondary hardening, (S807) device separation, and (S808) test sorting and taping.
[0096] In the substrate material selection and pr...
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Abstract
The present invention provides manufacturing methods for a power LED substrate with a mounting hole and a heat sink and for its power LED product and products thereof. The disclosed fabrication methods for power LED heat-dissipating substrate include the following steps a) selecting substrate material and processing; b) fabricating heat sink; c) assembling substrate and heat sink. The manufacturing methods of power LED products are based upon the manufacturing methods for heat-dissipating substrate, including the following steps: mounting LED die, bonding wire, packaging, post hardening, separating components, testing, classifying, and taping.
Description
technical field [0001] The present invention relates to a power LED heat dissipation substrate and a method for manufacturing a power LED product thereof and products thereof, in particular to a power LED heat dissipation substrate with a sink hole and a heat sink structure and a method for manufacturing a power LED product thereof The product. Background technique [0002] Due to its small size, long life, low driving voltage, low power consumption, fast response, and good shock resistance, power LEDs are showing a tendency to replace traditional lighting sources. Power LED packaging mainly involves light, heat, electricity, structure and technology, etc., especially for high-power LEDs. Among them, heat dissipation is an important factor affecting the light efficiency and life of power LEDs. At present, the electro-optic conversion efficiency of high-power LED is about 15%, and the remaining 85% is converted into heat energy, and the emission spectrum of white LED does no...
Claims
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IPC IPC(8): H01L25/075H01L25/13H01L23/367H01L33/00
CPCH01L25/0753H01L33/642H01L33/486H01L2933/0075H01L2224/48091H01L23/3677H01L2924/1815H01L2224/45144H01L2924/01322H01L2924/181Y10T29/49124H01L2924/00014H01L2924/00H01L2924/00012H01L33/64
Inventor 余彬海李军政夏勋力
Owner FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD