Polishing pad and method of manufacturing the same

Abstract

The present invention relates to a polishing pad and its manufacturing method. The polishing pad includes a plurality of fibers and a polymer elastomer compound. These fibers are interlaced to form a fibrous matrix. The polymer elastomer compound is composed of a first polymer elastomer resin and a second polymer elastomer resin, wherein the weight average molecular weight of the first polymer elastomer resin is 100,000-300,000, and the second polymer elastomer resin is elastic The body resin is a two-component polymer elastomer resin, which includes a first component and a second component. The first component is a polyester polyol with a molecular weight of 1500 to 2500, and its weight percentage is 1% to 15% %, the second component is a polyester polyol with a molecular weight of 3500 to 4500, and its weight percentage is 85% to 99%. Therefore, the polishing pad not only has better rigidity and high planarization efficiency, but also has interconnected holes and active fibers, so that the workpiece to be polished / grinded has excellent surface quality.

Description

technical field [0001] The invention relates to a polishing pad and a manufacturing method thereof, especially a polishing pad with interconnected holes and a manufacturing method thereof. Background technique [0002] refer to figure 1 , which shows a schematic cross-sectional view of the first known polishing pad disclosed in Taiwan Patent Publication No. 200641193. The polishing pad 1 is a non-woven polishing pad, which includes a plurality of fibers 12 and a resin 14 . The manufacturing method of the polishing pad 1 uses a composite material of fibers 12 such as velvet or suede and a resin 14, or impregnates a non-woven fabric formed of these fibers 12 into a thermoplastic polyurethane resin 14 and makes it wet. A thin sheet with large compressive deformation and softness formed by solidification. The disadvantage of the polishing pad 1 is that its softness easily leads to poor flattening of the polishing surface, and the resin 14 cannot evenly cover the fibers 12 , t...

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Problems solved by technology

The disadvantage of the polishing pad 1 is that its softness easily leads to poor flattening of the polishing surface, and the resin 14 cannot evenly cover the fibers 12, that is, some fibers 12 are not covered by the resin 14.

However, the biggest problem of the polishing pad 2 is that because the concentration distribution of the resin 24 in the circular mold cylinder is difficult to be uniform, the difference in temperature distribution at each position of the circular mold cylinder during molding will cause the size of these holes 22 And the distribution is not uniform and difficult to control, and after the slicing process, the size of the holes 22 on the slicing surface of the polishing pad 2 will be more obvious

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