Check patentability & draft patents in minutes with Patsnap Eureka AI!

LED surface light source and manufacturing method thereof

A technology of LED surface light source and LED chip, which is applied in the direction of plane light source, light source, and semiconductor devices of light-emitting elements, etc., which can solve the problems of large stress on the substrate chip, shortened life of the LED chip, and local temperature rise, etc., to achieve failure. Reduced probability, reduced welding points, and high processing efficiency

Active Publication Date: 2016-09-07
陈炜旻
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the use of the LED light source, the heat released by the LED chip will cause the local temperature to rise. Although the released heat will be released by the heat sink on the back of the LED substrate, the shortened life of the LED chip and thermal expansion caused by the temperature rise are still problems for LEDs. The key issues that need to be solved in packaging, for example, in the environment of large temperature difference, the thermal expansion of the substrate causes a lot of stress in the working state of the chip. When the power LED chip is used, it may even cause the chip to break and the wires on the solder joint to be desoldered, which is also a key factor that restricts the further thinning and enlargement of the LED chip.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED surface light source and manufacturing method thereof
  • LED surface light source and manufacturing method thereof
  • LED surface light source and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] Such as Figure 1 to Figure 3 As shown, Embodiment 1 of the present invention is an LED surface light source. The surface light source includes a first power supply external lead electrode 1 and a second power supply external lead electrode 6 for supplying power to the entire light source, LED chips 2 of strip-shaped cloth, strips The chip connecting wire 3 of the strip-shaped cloth, the positive pad 4 of the LED chip of the strip-shaped cloth, the negative pad 5 of the LED chip of the strip-shaped cloth, the positive pad 4 and the negative pad 5 of the adjacent chip 2 are connected by the chip The wires 3 are connected together to form a continuous circuit. another example figure 2 As shown, the spherical rubber block 8 in the first adhesive layer covers the single chip 2 and the positive and negative electrode pads; the segmented spherical rubber block 8 is covered with a continuous colloid lens layer 9, that is, the second an adhesive layer, and the hardness of t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an LED surface light source, which comprises a substrate and a plurality of LED chips installed on the substrate. It is composed of two discontinuous glue blocks, each piece of glue is covered with more than one LED chip, and there is an encapsulation layer that continuously covers the first glue layer outside the first glue layer. The LED surface light source has the advantage of long service life.

Description

technical field [0001] The invention relates to an LED lighting fixture and a manufacturing method thereof, in particular to an LED surface light source in which the LED is used as a luminous body and a manufacturing method thereof. Background technique [0002] As a light source for lighting appliances, the internal light-emitting part of the existing COB-packaged LED surface light source is composed of a plurality of interconnected LED chips. The way to install LED chips is usually to install the LED chips on the substrate first, and then coat the adhesive layer on the substrate and the LED chips. [0003] During the use of the LED light source, the heat released by the LED chip will cause the local temperature to rise. Although the released heat will be released by the heat sink on the back of the LED substrate, the shortened life of the LED chip and thermal expansion caused by the temperature rise are still problems for LEDs. The key issues that need to be solved in pac...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/54H01L33/58F21K9/00F21K9/90F21Y105/00F21Y115/10
Inventor 陈炜旻
Owner 陈炜旻
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com