Room-temperature cured phenyl silicon resin conformal coating

A phenyl silicone resin, room temperature curing technology, applied in coatings and other directions, can solve the problems of low surface hardness, low surface strength and hardness, poor toughness, etc., and achieve the effects of high transparency, excellent high and low temperature performance, and good elasticity

Active Publication Date: 2012-01-04
MIANYANG WELLS ELECTRONICS MATERIAIS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As we all know, organosilicon materials (such as silicone rubber, silicone gel and silicone resin, etc.) are widely used in various electronic components due to their good comprehensive properties for insulation, moisture-proof, shock-proof and related electronic components. protective effect; single-component silicone rubber can be cured at room temperature, and the dielectric properties are relatively good, but the surface strength and hardness after curing are low, and the application is limited; two-component silicone rubber needs to be measured by two components Coating or potting after mixing is not conducive to efficient construction and is also limited by the operating time; silicone gel has high transparency, but the surface hardness is lower after curing, and it is easy to absorb dust, so it cannot be applied outdoors or exposed In the harsh environment; silicone resin can achieve high surface hardness and strength after curing, but most silicone resins (such as methyl silicone resin, silicone glass resin, etc.) have poor toughness after curing, and are prone to high and low temperature impact In addition, most silicone resins usually need to be cured at high temperature (150°C or even above 200°C), which not only far exceeds that of some electronic devices (such as various printed circuit board assemblies) The highest temperature it can withstand, and high temperature operation will also bring great trouble to assembly and production

Method used

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  • Room-temperature cured phenyl silicon resin conformal coating
  • Room-temperature cured phenyl silicon resin conformal coating
  • Room-temperature cured phenyl silicon resin conformal coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Add 300g of phenyltrimethoxysilane and 300g of toluene into a 1L three-necked flask, add 60g of aqueous hydrochloric acid solution with a mass fraction of 0.01% dropwise into the flask under normal temperature and rapid stirring, and control the dropping time at about 20min. After the completion, the temperature was raised to 75°C for reflux reaction for 3 hours. After the reflux reaction, the temperature was lowered to 50°C and 1.06g of hexamethyldisilazane was added to stir the reaction for 0.5h. After that, the reaction was stopped, and the reaction liquid was cooled and allowed to stand before filtering , the temperature of the filtered reaction solution was raised to 120° C. to distill off the by-product methanol and part of the solvent to obtain 352 g of translucent phenyl silicone resin with a solid content of 60%.

[0024] Add 190g of the above-prepared phenyl silicone resin, 63g of hydroxyl-terminated polydimethylsiloxane with a viscosity of 80mpa.s and 278g of ...

Embodiment 2

[0027] 220g of phenyltrimethoxysilane, 64g of methylphenyldimethoxysilane and 295g of toluene were added to a 1L three-necked flask, and 73.3g of aqueous hydrochloric acid solution with a mass fraction of 0.01% was added dropwise to the flask under normal temperature and rapid stirring. The dropping time is controlled at about 20 minutes. After the hydrochloric acid aqueous solution is added dropwise, the temperature is raised to 75°C for reflux reaction for 4.5h. After the reflux reaction is completed, the temperature is lowered to 50°C and 1.29g of hexamethyldisilazane is added to stir the reaction for 0.5h. , then stop the reaction, filter the reaction solution after cooling and standing still, heat the filtered reaction solution to 120-130°C under normal pressure to distill off by-product methanol and part of the solvent to obtain 325g of translucent phenyl silicone resin, of which The solids content is about 55%.

[0028] Add 210g of the methylphenyl silicone resin prepar...

Embodiment 3

[0031] Using the phenyl silicone resin prepared in Example 1, replace the hydroxyl-terminated polydimethylsiloxane with a viscosity of 80mpa.s in Example 1 with the hydroxyl-terminated polydimethylsiloxane with a viscosity of 200mpa.s , and other conditions remain unchanged, the conformal coating Ⅲ was prepared.

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Abstract

The invention discloses a room-temperature cured phenyl silicon resin conformal coating which comprises components A) a segmented copolymer of phenyl silicon resin and linear polyorganosiloxane or methyl phenyl silicon resin and linear polyorganosiloxane, B) alkoxy silane, C) a silane coupling agent containing amino or epoxy group, D) an organic titanium compound, E) organic phosphate flame retardant synergist, and (F) an organic hydrocarbon solvent or low molecular weight siloxane, wherein the organic hydrocarbon solvent is one or multiple of methylbenzene, dimethylbenzene, petroleum ether, cyclohexane and normal heptane; and the low molecular weight siloxane is a mixture of octamethyl-trisiloxan, octamethyl cyclotetrasiloxane or methyl cyclosiloxane. A product produced by the cured resin conformal coating of the invention has the advantages of very high transparency, good elasticity, tough and wearable surfaces as well as excellent high / low temperature performance, waterproofing, heat resistance, cold resistance, weathering resistance, ultraviolet ray resistance, medium resistance, irradiation resistance, flame retarding and the like.

Description

technical field [0001] The invention relates to a resin coating, in particular to a room-temperature-curable phenyl silicone resin conformal coating. Background technique [0002] With the development of science and technology, the long-term and reliable protection of sensitive circuits and components is becoming more and more important in many delicate and demanding electronic product applications. As we all know, organosilicon materials (such as silicone rubber, silicone gel and silicone resin, etc.) are widely used in various electronic components due to their good comprehensive properties for insulation, moisture-proof, shock-proof and related electronic components. protective effect; single-component silicone rubber can be cured at room temperature, and the dielectric properties are relatively good, but the surface strength and hardness after curing are low, and the application is limited; two-component silicone rubber needs to be measured by two components Coating or ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D183/10C09D7/12C09D5/25
Inventor 芦成陆南平
Owner MIANYANG WELLS ELECTRONICS MATERIAIS
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