Cleaning process for high-density interconnected printed circuit board (HDI PCB)
A printed circuit board and high-density interconnection technology, which is applied in the secondary processing of printed circuits, cleaning/polishing of conductive patterns, etc., to avoid the risk of wedge-shaped hole breakage, improve production efficiency and turnover rate, and save production costs.
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Embodiment 1
[0024] For the cleaning of high-density interconnected printed circuit boards used in mobile phones and digital cameras, the diameter of the blind hole is 0.127mm (5mil). The specific cleaning process is as follows:
[0025] a. The use pressure is 50kg / cm 2 Clean the surface and blind holes of high-density interconnected printed circuit boards with clean water at room temperature;
[0026] b. Put the high-density interconnected printed circuit board of step a into the ultrasonic cleaning tank. The ultrasonic cleaning tank wall is equipped with an ultrasonic generator. The ultrasonic frequency is 23KHz. The current of the ultrasonic generator is 2.0A. The power of the ultrasonic generator is 1200W, a total of four ultrasonic generators are installed in the ultrasonic cleaning tank, the water temperature in the ultrasonic cleaning tank is controlled at 35 ℃, and the ultrasonic cleaning time is 1 minute;
[0027] c. Use the high-density interconnected printed circuit board of s...
Embodiment 2
[0036] For the cleaning of high-density interconnected printed circuit boards used in mobile phones and digital cameras, the diameter of the blind hole is 0.127mm (5mil). The specific cleaning process is as follows:
[0037] a. The use pressure is 70kg / cm 2 Clean the surface and blind holes of high-density interconnected printed circuit boards with clean water at room temperature;
[0038] b. Put the high-density interconnected printed circuit board of step a into the ultrasonic cleaning tank. The ultrasonic cleaning tank wall is equipped with an ultrasonic generator. The ultrasonic frequency is 33KHz. The current of the ultrasonic generator is 3.0A. The power of the ultrasonic generator is 1200W, a total of four ultrasonic generators are installed in the ultrasonic cleaning tank, the water temperature in the ultrasonic cleaning tank is controlled at 45 ℃, and the ultrasonic cleaning time is 3 minutes;
[0039] c. Use the high-density interconnected printed circuit board of ...
Embodiment 3
[0048] For the cleaning of high-density interconnected printed circuit boards used in mobile phones and digital cameras, the diameter of the blind hole is 0.127mm (5mil). The specific cleaning process is as follows:
[0049] a. The use pressure is 60kg / cm 2 Clean the surface and blind holes of high-density interconnected printed circuit boards with clean water at room temperature;
[0050]b. Put the high-density interconnected printed circuit board in step a into the ultrasonic cleaning tank. The ultrasonic cleaning tank wall is equipped with an ultrasonic generator. The ultrasonic frequency is 28KHz. The current of the ultrasonic generator is 2.5A. The power of the ultrasonic generator is 1200W. There are four ultrasonic generators installed in the ultrasonic cleaning tank. The water temperature in the ultrasonic cleaning tank is controlled at 40°C, and the ultrasonic cleaning time is 2 minutes;
[0051] c. Use the high-density interconnection printed circuit board of step ...
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