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Printed circuit board module

A technology of printed substrates and printed wiring boards, which is applied in the fields of printed circuits, printed circuits, and printed circuit manufacturing, and can solve problems such as the complex structure of printed substrate modules

Inactive Publication Date: 2014-01-22
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since such a printed substrate module has a plurality of elements, the printed substrate module is formed into a complicated structure

Method used

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  • Printed circuit board module
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  • Printed circuit board module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0035] figure 1 The appearance of the server computer device 11, which is a specific example of electronic equipment, is schematically shown. The server computer device 11 includes a housing 12 . The storage space is divided and formed in the frame body 12 . A motherboard is arranged in the storage space. Semiconductor components such as electronic component packages and a main memory are mounted on the motherboard. The electronic component package executes various calculation processes based on, for example, software programs and data temporarily held in the main memory. Software programs and data can be stored in a mass storage device such as a hard disk drive (HDD) that is also placed in the storage space. Such a server computer device 11 is mounted on a rack, for example.

[0036] figure 2 The appearance of the main board 13 which is the printed circuit boar...

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PUM

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Abstract

As a base (21), a side wall (22), and a top board (23) are integrated by integral molding in a printed circuit board module (15), the printed circuit board module (15) is structured in a simple manner. Further, conductive terminals (24) are used for fitting a printed circuit board (17). The printed circuit board (17) is securely held between the electrically conductive terminals (24) and the top board (23) via an elasticity of the conductive terminals (24). Here, due to the functioning of the notches (33), the printed circuit board (17) is positioned in a simple manner. Due to the functioning of the base (21), a printed circuit board module (13) can stand erect. The printed circuit board (17) establishes a vertical posture. The packaging area is reduced. The packaging density improves. Further, the flat surface (23a) of the top board (23) that is formed facing upward with a certain extension is used as, for example, an absorbent face.

Description

technical field [0001] The present invention relates to a printed circuit board module in which a printed circuit board in a vertical posture is mounted on the surface of a printed wiring board. Background technique [0002] For example, a printed circuit board module is mounted on the surface of a printed wiring board of a main board. The printed circuit board module includes a printed circuit board called a memory board. A first molding having surface mount terminals is disposed on one side of the memory board. On the other side surface of the memory board, the second molded material sandwiching the memory board between the first molded material and the first molded material is arranged. The independent standing of the printed substrate is established with the first molding and the second molding. A cap member defining a flat suction surface for suction by a robot, for example, is attached to the upper end of the memory plate. [0003] Patent Document 1: Japanese Paten...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14
CPCH05K3/366H05K2201/1034H05K2201/10962H05K2201/10424H05K3/3405H05K3/301H05K1/03H05K1/141H05K3/3421H01L2924/15162H05K1/14H05K3/36
Inventor 江口进板仓和彦
Owner FUJITSU LTD