Light-emitting diode (LED) chip with flip chip structure and manufacturing method thereof

Abstract

The invention provides a light-emitting diode (LED) chip with a flip chip structure and a manufacturing method thereof. The manufacturing method comprises the following steps: firstly, growing out an N-type semiconductor layer, a quantum well layer and a P-type semiconductor layer in sequence on a growth substrate by adopting an epitaxial method; manufacturing a first N electrode on the N-type semiconductor layer and manufacturing a first P electrode for bonding on the P-type semiconductor layer so as to form a chip structure to be bonded; then manufacturing a second N electrode and a second P electrode which respectively correspond to the first N electrode and the first P electrode on another high-heat conduction substrate, and enabling the second N electrode and the second P electrode to be electrically isolated from each other so as to form a substrate structure to be bonded; and then bonding the chip structure with the substrate structure so as to form the light-emitting diode chip. The formed light-emitting diode chip has high light-emitting efficiency and is also capable of improving the temperature damage of power-type LEDs.

Description

technical field [0001] The invention relates to a light-emitting diode chip with a flip-chip structure and a manufacturing method. Background technique [0002] Light-emitting diodes have long service life, short start-up time, firm structure, energy saving, illuminants close to point light sources, wide range of thin lamp materials, no need to apply reflectors, low voltage, no ultraviolet radiation, and are safer to use in public environments. Mercury-free production has many advantages such as environmental protection and energy conservation. Therefore, it is widely used in building exterior lighting, landscape lighting, signage and indicative lighting, indoor space display lighting, entertainment venues and stage lighting, video screens and Industrial design and other fields have a wide range of applications. In particular, high-power light-emitting diodes, because they may realize semiconductor solid-state lighting, have caused a revolution in the history of human light...

AI Technical Summary

Problems solved by technology

Among them, most of the existing reverse soldering technology adopts a gold ball bonding method, which is easy to damage the chip, and the bonding firmness is not ideal. Therefore, how to break through the existing bonding technology has become a problem for those skilled in the art. Technical issues to be solved urgently

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