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Film having electromagnetic shielding effect and manufacturing method thereof

A technology of film and epoxy resin, which is applied in the fields of magnetic/electric field shielding, printed circuit manufacturing, chemical instruments and methods, etc., can solve the problems of poor flexibility of stainless steel sheets, heavy weight of stainless steel sheets, high price of stainless steel sheets, etc., to increase the deflection High performance, reduced production cost, and simple production

Active Publication Date: 2012-03-14
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the weight of the stainless steel sheet is relatively large, thereby increasing the weight of the circuit board product
And the flexibility of the stainless steel sheet is poor, and the electromagnetic shielding layer made of stainless steel sheet affects the flexural performance of the flexible circuit board
Due to the high price of stainless steel sheets, the production cost of the circuit board is increased

Method used

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  • Film having electromagnetic shielding effect and manufacturing method thereof
  • Film having electromagnetic shielding effect and manufacturing method thereof
  • Film having electromagnetic shielding effect and manufacturing method thereof

Examples

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Effect test

Embodiment Construction

[0020] The film with electromagnetic shielding effect provided by the technical solution and the manufacturing method thereof will be further described in detail below with reference to the embodiments.

[0021] see figure 1 , The technical solution provides a film 100, which includes a release substrate layer 110, an epoxy resin composite material layer 120 and a release isolation layer 130 stacked in sequence.

[0022] The release substrate layer 110 is used to carry the epoxy resin composite material layer 120 . The release substrate layer 110 can be a PET release film, that is, the substrate is PET, and one or two opposite surfaces of the substrate are coated with materials such as silicone oil to form a release surface. The release surface can adhere to the epoxy resin composite material layer 120 formed thereon, but is easy to separate the release substrate layer 110 from the epoxy resin composite material layer 120 . In this embodiment, the release substrate layer 110...

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Abstract

The invention relates to a film, which comprises a release type substrate layer and an epoxy resin composite material layer. The release type substrate layer has a first release type surface and the epoxy resin composite material layer is formed on the first release type surface. And the epoxy resin composite material layer is formed by an epoxy resin composite material that comprises an epoxy resin modified by carboxyl end group polymer, a carbon nano tube and an inorganic dispersion material. Besides, the mass percent of the carbon nano tube accounts for 4.6% to 16% of that of the epoxy resin composite material; and the viscosity of the epoxy resin composite material is from 60000 centipoises to 75000 centipoises. In addition, the invention provides a manufacturing method for the film.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a film used in the production of circuit boards and having an electromagnetic shielding effect and a manufacturing method thereof. Background technique [0002] With the advancement of science and technology, printed circuit boards have been widely used in the electronic field. For the application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans .on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] As the number of layers of circuit board products increases, electromagnetic interference often occurs when the circuit board products are actually working, which affects the signal transmission of the circuit board. In this way, an electromagnetic shielding layer needs to be provided in the circui...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H05K3/00B32B27/18B32B27/38
Inventor 何明展
Owner AVARY HLDG (SHENZHEN) CO LTD
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