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Ka-waveband power combiner based on SIW (Substrate Integrated Waveguide)

A substrate-integrated waveguide and power combiner technology, applied in waveguide devices, electrical components, connecting devices, etc., can solve the problems of insufficient differential loss, small reflection bandwidth, and large size, and achieve small differential loss and small size , the effect of low production cost

Inactive Publication Date: 2013-11-27
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the structure designed by Jin Haiyan and others, the power divider adopts 360-degree power division, and the branch signal difference is two 360-degrees during synthesis, which can only meet this requirement at a specific frequency point, so the reflection bandwidth is small and the size Bigger, but not small enough

Method used

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  • Ka-waveband power combiner based on SIW (Substrate Integrated Waveguide)
  • Ka-waveband power combiner based on SIW (Substrate Integrated Waveguide)
  • Ka-waveband power combiner based on SIW (Substrate Integrated Waveguide)

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specific Embodiment approach

[0031] The structural block diagram of the Ka-band compact power combiner based on the substrate integrated waveguide of the present invention is as follows: image 3 shown. Its specific implementation is as follows:

[0032] 1) The design of the Y-type microstrip line 2 equal power divider A1, because the actual test and most of the related circuits use a 50-ohm interface, the input microstrip impedance is 50 ohms (the Ka-band 50-ohm microstrip line width is 0.78mm) , in order to achieve impedance matching, the parallel output microstrip impedance is 100 ohms (Ka band 100 ohms microstrip line width 0.21mm).

[0033]2) The over-gradient microstrip line A2 between the Y-type microstrip line 2 equal power divider A1 and the half-mode substrate integrated waveguide 2 equal power divider A3 adopts a trapezoidal transition, which is optimized by HFSS simulation. and the bottom are 0.21mm and 1.4mm respectively; the top and bottom of the trapezoidal microstrip transition line B3 b...

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Abstract

A Ka-waveband power combiner based on SIW (Substrate Integrated Waveguide) belongs to the technical field of microwave / millimeter wave devices, and comprises an input signal power dividing structure and a power combining output structure, wherein the input signal power dividing structure comprises a first-stage Y-shaped microstrip line halving power divider and a second-stage half-model substrate integral waveguide halving power divider; and the two half-model substrate integral waveguide halving power dividers are arranged back to back and output towards two external sides; the power combining output structure comprises two half-model substrate integral waveguide power combiners and one half-model-full-model substrate integral waveguide power combiner; the power combiners have a structure of being symmetrical relative to center lines; and the two half-model substrate integral waveguide power combiners form a semi-encircling structure for the two half-model substrate integral waveguide halving power dividers, so that the power combining output structure and the input signal power dividing structure form an embedded combination, thus realizing structurally tightening. The Ka-waveband power combiner has the advantages of small size, excellent performance, low cost, light weight, easiness for transplanting and convenience in integration.

Description

technical field [0001] The invention belongs to the technical field of microwave / millimeter wave devices, and relates to a Ka-band power combiner, in particular to a compact power combiner based on a substrate integrated waveguide. Background technique [0002] As a common device in millimeter-wave systems and a basic technology to improve the output power of millimeter-wave solid-state circuits, millimeter-wave power synthesizing amplifiers have been receiving keen attention and research from scholars at home and abroad. It obtains greater output power by combining several coherent units, or by superimposing the power of multiple separate circuits. It mainly adopts the form of metal waveguide and planar microstrip circuit. The traditional metal waveguide structure has low differential loss and high Q value, but its cost is high and its weight is high. Although the microstrip structure is light in weight and is a planar structure, its differential loss large, which limits t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/12
Inventor 林先其江源朱忠博于家伟樊勇
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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