Laminated composite solder

A layered composite and composite solder technology, which is applied in the direction of welding/cutting media/materials, welding media, metal processing equipment, etc., can solve the problems that are not easy to be formed into thin strips or ribbons, limited precious metal resources, and restricted use, etc., to achieve Save the amount of precious metals, meet the performance requirements, and increase the service life

Inactive Publication Date: 2012-04-04
YUNNAN WODIAN TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of brazing filler metal is expensive because it contains precious metals and precious metal resources are limited; in order to reduce the amount of precious metals in the brazing filler metal, some brazing filler metals are formed by adding Cd, Zn, etc. to form new alloys, but due to the high vapor pressure of Cd, Zn Such elements exist and cannot be used in the vacuum electronics industry. Some solders are formed by adding Sn and Si to form alloys. However, due to the addition of Sn, Si and other elements, the material is too brittle to form thin strips or ribbons, which greatly limit their use

Method used

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  • Laminated composite solder
  • Laminated composite solder

Examples

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Embodiment 1

[0019] The middle layer metal is oxygen-free copper strip, and the upper and lower layer metals are AgCu 28 (or AgCu 10 、AgCu 15 、AgCu 50 etc.) alloy strip. Cut the strips into equal widths, clean the surface of the strips, stack them for rolling and compounding, and then roll them to a thickness of 0.1mm after diffusion annealing. The thickness ratio of the upper, middle and lower layers is 1:4 :1 (or 1:3:1, 1:2:1), to obtain layered composite solder.

Embodiment 2

[0021] The middle layer metal is oxygen-free copper strip, and the upper and lower layer metals are AgCu 50 Ni 0.4 alloy strip. Cut the strips into equal widths, clean the surface of the strips, stack them for rolling and compounding, and then roll them to a thickness of 0.1mm after diffusion annealing. The thickness ratio of the upper, middle and lower layers is 1:2.5 : 1, to obtain layered composite solder.

Embodiment 3

[0023] The middle layer metal is CuAg 7 Alloy strip, the upper and lower layer metal is AgCu 27 In 10 alloy strip. Cut the strips into equal widths, clean the surface of the strips, stack them for rolling and compounding, and then roll them to a thickness of 0.1mm after diffusion annealing. The thickness ratio of the upper, middle and lower layers is 1:5 : 1, to obtain layered composite solder.

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PUM

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Abstract

The invention relates to a laminated composite solder, which is used for welding base materials such as metals, the metals and ceramics, the ceramics and the like. The composite solder consists of an upper layer, a middle layer and a lower layer in the thickness ratio of (0.5-2):(0.5-4):(0.5-2), wherein the upper layer and lower layer are made of the same precious metal alloy or a precious metal alloy respectively; the middle layer is made of oxygen-free copper or a copper-silver alloy; precious metal-based alloys on the upper and lower layers are one or two of Ag, AgCu (10-50), AgCu(10-50)Ni(0.1-0.45), AgCu(23-28)In(9-16), AgCu(20-32)Pd(5-20), Au(79-81)Cu(19-21), Au(82-83)Ni(17-18) and AuAg(2-20)Cu(10-55); and all the three layers are in a metallurgy bonding state. The composite solder has high welding performance and can meet the performance requirements of a vacuum electronic industry on solder materials.

Description

technical field [0001] The invention relates to the technical field of welding materials, in particular to a layered composite brazing filler metal used for welding base materials such as metal and metal, metal and ceramics, ceramics and ceramics. Background technique [0002] At present, in the vacuum electronics industry, some solders use silver-based or gold-based solders for welding copper, ceramics, expansion alloys and other materials. This type of brazing filler metal is expensive because it contains precious metals and precious metal resources are limited; in order to reduce the amount of precious metals in the brazing filler metal, some brazing filler metals are formed by adding Cd, Zn, etc. to form new alloys, but due to the high vapor pressure of Cd, Zn Such elements exist and cannot be used in the vacuum electronics industry. Some solders are formed by adding Sn and Si to form alloys. However, due to the addition of Sn, Si and other elements, the material is too ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30
Inventor 张明
Owner YUNNAN WODIAN TECH DEV
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