Semiconductor device and method for fabricating semiconductor device
A semiconductor and component technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as large silicon, improve reliability, increase pass rate, and increase production capacity.
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[0048] The invention provides a semiconductor component with a bonding pad structure and a process for forming the semiconductor component, wherein the bonding pad structure is provided with a stress buffer layer. The above-mentioned semiconductor components may have copper pillars, pillar protection (Passivation) interconnection lines, solder bumps, and / or through-silicon vias (TSVs) fabricated therein, wherein the semiconductor components may be applied to overlay Assembly, WLCSP, three-dimensional integrated circuit (3D-IC) stacking, and / or any advanced packaging technology field. A detailed description will be given below with reference to exemplary embodiments in the corresponding drawings. Wherever possible, the same reference numbers are used in the drawings and description to refer to the same or like parts. In the drawings, shapes and thicknesses may be exaggerated for clarity and convenience. The invention is to be directed in particular to components which form pa...
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