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Circuit board copper surface processing method

A processing method and circuit board technology, applied in the secondary processing of printed circuits, cleaning/polishing of conductive patterns, etc., can solve the problems of affecting functions, poor use, uneven coating unevenness, and achieve the effect of improving flatness and reducing scars

Active Publication Date: 2013-09-11
SHENNAN CIRCUITS
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  • Summary
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Problems solved by technology

However, during the brushing process, these particles will inevitably leave deep marks on the copper surface of the circuit board under the action of pressure, and the plating layer formed in the subsequent electroplating or electroless plating processes will remain consistent with the appearance of the copper surface. Consistent, this leads to obvious unevenness on the plating layer formed on the copper surface of the circuit board after brushing, which not only affects the appearance, but also affects the function, resulting in poor use

Method used

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  • Circuit board copper surface processing method

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Embodiment 1

[0013] Please refer to figure 1 , an embodiment of the present invention provides a copper surface treatment method of a circuit board, comprising:

[0014] 101. The treatment agent is obtained by mixing fine stone particles with water, and the hardness of the fine stone particles is greater than that of copper.

[0015] The method in this embodiment is a method for treating the copper surface of the circuit board by using a spraying process. The spray material used is a treatment agent obtained by mixing fine stone particles with water. In the treatment agent, the hardness of fine stone particles is greater than that of copper. Said fine stone particles can specifically be aluminum oxide particles, silicon oxide particles, silicon carbide particles or iron oxide particles or their mixtures. Preferably, alumina particles can be used. Further, the particle size of the fine stone particles can be between 20 and 150 microns, and the purity can be above 85%, the higher the pur...

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Abstract

The invention discloses a circuit board copper surface processing method which comprises the following steps: mixing fine stone particles with water to obtain a processing agent, wherein the hardness of the fine stone particles is greater than that of copper; utilizing compressed gas as power to spray out the processing agent from a nozzle, thus forming spray beams; and utilizing the spray beams to impact a circuit board, thus realizing the circuit board copper surface processing. According to the technical scheme of the invention, not only can the circuit board copper surface processing be realized, but also the damage to a circuit board copper surface can be reduced. Compared with a brush graining method, the method disclosed by the invention can be used for improving the flatness of the processed circuit board copper surface.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for treating the copper surface of a circuit board. Background technique [0002] In the process of circuit board production, it is usually necessary to treat the copper surface of the circuit board in order to remove the plug hole residue on the copper surface and foreign matter on the copper surface, as well as roughen the copper surface to strengthen the bonding force and realize the polishing of the board surface. [0003] A commonly used treatment method for the copper surface of the circuit board is to use the brush grinding method. The main mechanism of action is to make the high-speed rotating brush grinding wheel or abrasive belt contact the copper surface of the circuit board under stable pressure, and use silicon carbide or aluminum oxide. Abrasives are used to treat the copper surface of the circuit board to remove foreign matter on the coppe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/26
Inventor 胡鑫刘良军
Owner SHENNAN CIRCUITS
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