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Micro tensile measurement unit and production method thereof

A technology for measuring components and manufacturing methods, which is applied in the direction of measuring devices, piezoelectric devices/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, etc., and can solve problems such as complex manufacturing processes and performance degradation of mechanical sensors , to achieve the effect of simple and easy operation, overcome the thick glue process and microstructure planarization technology, and reduce the production cost

Inactive Publication Date: 2012-04-18
SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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  • Claims
  • Application Information

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Problems solved by technology

Although the mechanical sensor produced by this production method can meet the high-precision measurement problem, the production process needs to adopt thick glue technology and microstructure flattening technology, and the production process is relatively complicated. Performance drop

Method used

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  • Micro tensile measurement unit and production method thereof
  • Micro tensile measurement unit and production method thereof
  • Micro tensile measurement unit and production method thereof

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Embodiment Construction

[0029] The technical solution of the present invention will be further described below in conjunction with a preferred embodiment and the accompanying drawings.

[0030] refer to figure 1 , the micro-tensile measurement assembly is made of stainless steel 301, including a fixed platform 1 and a mobile platform 12, wherein the fixed platform 1 is provided with a positioning hole 2, an alignment groove 5 and a sample fixed platform 4, and the sample fixed platform 4 There is a sample centering mark 3 on it; a plurality of curved springs 7 for sensing loads, positioning holes 11, alignment bumps 6 and a sample fixing platform 10 are distributed on the mobile platform 12, and the sample fixing platform 10 is provided with Sample alignment marker 8 and displacement marker 9. The aforementioned positioning holes 2 and 11 are respectively used for fixing the fixed platform and the mobile platform.

[0031] The aforementioned alignment groove 5 cooperates with the alignment protrusi...

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Abstract

The invention discloses a micro tensile measurement unit and a production method thereof. The measurement unit comprises a fixed platform and a moving platform which are cooperated with each other, wherein, one end of the fixed platform is fixed connected with a first sample platform, one end of the moving platform is connected with a second sample platform through an elastic element, when measuring, two ends of a sample is respectively connected with the first sample platform and the second sample platform, and the second sample platform is provided with a second centring mark and a displacement mark which are cooperated with a first centring mark of the first sample platform. The production method comprises the following steps: taking a stainless steel substrate, carrying out photoetching and graphic processing on the stainless steel substrate, and then carrying out high temperature high temperature baking and electrochemical etching to obtain a target product. According to the invention, the measurement unit has simple and firm structure and is not easy to damage; the method is simple and easy to operate; the problems of thick rubber process and microstructure planarization technology required by present micro-electroforming technology are overcome, the problem of performance degradation of the mechanical sensor caused by micro-electroforming defects is prevented, the aligning precision of the device is increased, and simultaneously the production cost is reduced.

Description

technical field [0001] The invention particularly relates to a micro-tensile measuring component used in the technical field of film mechanical performance testing and a manufacturing method thereof, belonging to the field of micro-mechanical manufacturing. Background technique [0002] With the rapid development of MEMS technology, various thin film materials are widely used in various micro-nano devices. However, due to the influence of the size effect, when the device is small to the micro-nano scale, the mechanical properties of the material are significantly different from those of the bulk material, and different preparation methods may cause different organizational structures, resulting in significant differences in material properties. When designing MEMS / NEMS devices and conducting reliability analysis, it is urgent to know the mechanical performance parameters of the materials used, such as elastic modulus and fracture strength. At present, the mechanical perform...

Claims

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Application Information

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IPC IPC(8): G01N3/02B81B3/00B81C1/00
Inventor 李加东吴东岷
Owner SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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