Method for measuring three-dimensional shape
A detection method and technology of three-dimensional shape, which is applied in the field of high-level three-dimensional shape detection, can solve problems such as complex operation, and achieve the effect of improving accuracy, reducing time and memory
Inactive Publication Date: 2014-04-16
SNU PRECISION CO LTD
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[0005] In this way, because the conventional three-dimensional inspection method uses another reference plate other than the substrate on which the actual inspection object is installed, it is necessary to form a sine wave pattern on the reference plate and the substrate separately, and the operation is relatively complicated.
Moreover, in the height data of the detection object, there may be an error factor caused by the error between the thickness of the reference plate and the thickness of the substrate
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[0027] Hereinafter, an embodiment of the three-dimensional shape detection method of the present invention will be described in detail with reference to the accompanying drawings.
[0028] figure 1 is a schematic diagram of the three-dimensional shape detection device used in the three-dimensional shape detection method of the present invention.
[0029] Such as figure 1 As shown, the three-dimensional shape detection device 100 includes a control unit 10 , a workstation 20 , a projection unit 30 and an imaging unit 40 .
[0030] The control unit 10 fully controls the three-dimensional shape detection device 100 , and detects the three-dimensional shape of the object 3 by using the reflected image captured by the imaging unit 40 . At this time, the subject 3 includes the substrate 2 and the solder balls 1 arranged on the substrate 2 . In order to detect the three-dimensional shape of the solder balls 1 protruding from the substrate 2, the substrate 2 is moved to a detection...
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The present invention relates to a method for measuring a three-dimensional shape. The method for measuring the three-dimensional shape of an object having a substrate and a solder ball arranged on the substrate, comprises: a center-determining step of obtaining an image of the solder ball and determining the center of the solder ball; an image-acquiring step of forming a sine wave pattern on the object, and acquiring an integrated image containing images of both the upper surface of the substrate and of the solder ball; a phase value determination step of selecting, from within the integrated image, a reference line which is a virtual line passing through the center of the solder ball, extracting the phase value of the portion onto which the sine wave pattern is projected from the center of the solder ball located on the reference line and determining the extracted phase value to be a phase value of the center of the solder ball, and extracting the phase value of the portion onto which the sine wave pattern is projected from the substrate located on the reference line and determining the extracted phase value to be a phase value of the substrate; and a height calculating step of calculating the height from the upper surface of the substrate to the center of the solder ball using the difference between the phase value of the center of the solder ball and the phase value of the substrate.
Description
technical field [0001] The invention relates to a three-dimensional shape detection method. More specifically, it relates to a three-dimensional shape detection method for detecting the height of solder balls arranged on a substrate by using the phase difference of sine wave interference fringes. Background technique [0002] Usually, a three-dimensional shape detection device using Moore interference fringes forms Moore interference fringes by overlapping the lattice fringes displayed by irradiating a certain shape of light on the surface of the object to be inspected and the lattice fringes as a reference. The interference fringes are detected and analyzed to detect the height of the detection object relative to the reference plane. The three-dimensional shape detection device can obtain the three-dimensional shape of the object to be detected simply and quickly, so it is widely used in fields such as medicine and industry. [0003] The methods of using Moore interferenc...
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IPC IPC(8): G01B11/24G01B11/25G01B11/02
CPCG01B11/24G01B11/026H01L33/62
Inventor 朴喜载安祐正
Owner SNU PRECISION CO LTD