Epoxy resin composition for semiconductor packaging and preparation method thereof

A technology of epoxy resin and composition, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., and can solve the difficulties of processing or recycling halogen-containing wastes, metabolic disorders, restrictions on the use of halogen-containing flame retardants, etc. problems, to achieve the effect of excellent flow performance, enhanced stress relief, and low cost

Active Publication Date: 2012-05-02
JIANGSU HHCK NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a semiconductor plastic packaging material, the flame retardant performance of epoxy resin composition requires the national standard of UL-94V-0, and most of the flame retardants used in the industry are halogen derivatives or antimony-containing flame retardants, etc., due to these When the substance is burned, it will produce toxic gases such as dioxin and benzofuran, which may cause metabolic disorders in the human body or cause cancer; on the other hand, it is also quite difficult to dispose or recycle these halogen-containing wastes
Therefore, the use of halogenated flame retardants has been greatly restricted

Method used

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  • Epoxy resin composition for semiconductor packaging and preparation method thereof
  • Epoxy resin composition for semiconductor packaging and preparation method thereof
  • Epoxy resin composition for semiconductor packaging and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Example 1. An epoxy resin composition for semiconductor packaging, which includes: epoxy resin, curing agent, curing agent accelerator and inorganic filler; the epoxy resin contains the following formula (1) and formula (2) The epoxy resin described:

[0046]

[0047] Formula 1)

[0048]

[0049] Formula (2)

[0050] Among them: n is a positive integer of 1-12;

[0051] The weight of described epoxy resin accounts for 1-25% of the epoxy resin composition gross weight;

[0052] The curing agent is the phenolic resin described in formula (6),

[0053]

[0054] Formula (6)

[0055] Wherein m and n are both positive integers of 1-12;

[0056] The weight of described curing agent accounts for 1-25% of epoxy resin composition gross weight;

[0057] It also contains liquid nitrile rubber ETBN with epoxy functional group, and the weight of the liquid nitrile rubber ETBN with epoxy functional group accounts for 0.3-2.5% of the epoxy resin composition gross weigh...

Embodiment 2

[0059] Example 2. An epoxy resin composition for semiconductor packaging, which includes: epoxy resin, curing agent, curing agent accelerator and inorganic filler; the epoxy resin contains the following formula (1) and formula (2) The epoxy resin described:

[0060]

[0061] Formula 1)

[0062]

[0063] Formula (2)

[0064] Among them: n is a positive integer of 1-12;

[0065] The weight of described epoxy resin accounts for 1-25% of the epoxy resin composition gross weight;

[0066] The curing agent is a phenolic resin, which contains the phenolic resin described in formula (6), and it also contains one or more of the phenolic resins represented by formula (3), formula (4), and formula (5):

[0067]

[0068] Formula (3)

[0069]

[0070] Formula (4)

[0071]

[0072] Formula (5)

[0073]

[0074] Formula (6)

[0075] Wherein m and n are both positive integers of 1-12;

[0076] The weight of described curing agent accounts for 1-25% of epoxy resin ...

Embodiment 3

[0079] Example 3. In the epoxy resin composition for semiconductor encapsulation described in embodiment 1 or 2: the ratio of the epoxy equivalent in the epoxy resin to the hydroxyl equivalent in the phenolic resin is 0.5-1.5.

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PUM

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Abstract

The invention discloses an epoxy resin composition for semiconductor packaging, which comprises epoxy resin, curing agent, curing agent promoter and inorganic filler, and is characterized in that: the epoxy resin is the epoxy resin with the formula (1) and/or the formula (2); the weight of the epoxy resin is 1-25% of the total weight of the epoxy resin composition; the curing agent is phenolic resin containing the phenolic resin with the formula (6) or any one or more of the phenolic resins represented by the formula (3), the formula (4) and the formula (5); and the invention further discloses a preparation method of the epoxy resin composition. By optimizing types of the epoxy resin and adding the curing agent with uniformly flexible segments, and the like, the invention provides the resin composition of the curing agent with low cost, low stress, high reliability and excellent flow property.

Description

technical field [0001] The present invention relates to a kind of epoxy resin composition, relate in particular to a kind of epoxy resin composition suitable for the semiconductor encapsulation of Small Outline Package (SOP) and Quad Flat Package (QFP); The present invention also relates to aforementioned epoxy resin Method of preparation of the composition. Background technique [0002] Due to its inherent advantages of low shrinkage, good adhesion, electrical insulation and chemical resistance, epoxy resin has become an indispensable material in the packaging of electronic components and the production of electrical insulation materials. Epoxy molding compound is mainly composed of epoxy resin. It originated in the United States (Hysol) in the 1960s, and later developed more than Japan. Now China is a rapidly rising EMC power in the world. At the same time, due to its low cost, flexible operation, and convenient mass production compared with metal and ceramic materials, i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/62C08G59/20H01L23/29
Inventor 刘红杰谭伟
Owner JIANGSU HHCK NEW MATERIAL CO LTD
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