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Bonding alloy wire and production technology thereof

A production process and alloy wire technology, which is applied in the field of bonding alloy wire and its production process, can solve the problems of high price, influence on popularization and application, and only decrease but not increase, so as to achieve the effect of convenient and practical production process and cost reduction

Active Publication Date: 2013-01-23
浙江佳博科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The disadvantages of the existing gold bonding wires are high production costs and high prices, which directly affect the economic benefits of production enterprises and directly affect their popularization and application.
With the rapid rise of the international situation, the price of gold has risen from 250 yuan / gram in the same period last year to 350 yuan / gram now, and the price has increased by 40%. The price is about 1,000 yuan, and the current price is about 1,400 yuan. In the packaging industry products, gold wires account for about 30% of the entire product. That is to say, the overall product cost has increased by 12%. The price only goes down

Method used

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  • Bonding alloy wire and production technology thereof
  • Bonding alloy wire and production technology thereof
  • Bonding alloy wire and production technology thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The bonding alloy wire of the present invention includes a base material and a coating layer plated on the surface of the base material, wherein the base material is a silver material with a total purity ≥ 99.9%, and alloy elements calcium, palladium, and gold are added to the silver material, and the coating layer is gold.

[0035] Indium, nickel, copper, cerium, yttrium, aluminum, and magnesium are also added to the above base material.

[0036] The content of each alloy element calcium, palladium and gold added to the above base material is: 5-100ppm. Ppm refers to the unit of metal content, 1ppm = 0.0001% content, each alloy element is actually added more or less, mainly according to its role in the alloy.

[0037] In the present embodiment, the content of the added alloy elements is as follows, the unit is ppm:

[0038] Calcium = 10

[0039] Palladium = 50

[0040] Gold = 30

[0041] Indium = 30

[0042] Nickel = 10

[0043] Cerium = 30

[0044] The film th...

Embodiment 2

[0072] The difference between the embodiment of the present invention and embodiment 1 is that the following alloy is added to the substrate, and the content of the added alloy elements is as follows, in ppm:

[0073] Calcium = 8

[0074] Palladium = 15

[0075] Gold = 25

[0076] Indium = 10

[0077] Copper = 10

[0078] Yttrium = 20

[0079] Aluminum = 30

[0080] Magnesium = 10

[0081] In this example, the diameter of the substrate is Micron, the coating thickness is 0.10 micron, the diameter of the substrate is Micron, the coating thickness is 0.08 micron.

[0082] The annealing properties are as follows

[0083] A tensile tester is used with a preset length of 100mm and a tensile speed of 12mm / min. Consistent with bonding gold wire.

[0084] Take wire diameter Φ20 microns as an example

[0085]

Embodiment 3

[0087] The difference between the embodiment of the present invention and embodiments 1 and 2 is that the following alloys are added to the substrate, and the content of the added alloy elements is as follows, in ppm:

[0088] Calcium = 40

[0089] Gold = 80

[0090] Indium = 40

[0091] Cerium = 30

[0092] Magnesium = 25

[0093] In this embodiment, the diameter of the substrate is Φ25 microns, and the thickness of the coating film is 0.15 microns. When the diameter of the substrate is Φ23 microns, the thickness of the coating film is 0.14 microns.

[0094] The annealing properties are as follows

[0095] A tensile tester is used with a preset length of 100mm and a tensile speed of 12mm / min. Consistent with bonding gold wire.

[0096] Take wire diameter Φ25 microns as an example

[0097]

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Abstract

The invention relates to a bonding alloy wire and a production technology thereof. The bonding alloy wire comprises: a base material and a coating plated on a base material surface. The base material is a silver material with a total purity which is greater than or equal to 99.9% and the silver material is added with alloy elements: Ca, Pd and Au. The coating is gold. The production technology ofthe bonding alloy wire comprises the following steps: 1) casting the base material formed by the silver and the alloy elements; 2) performing a large wire drawing to the base material after the fusion casting; 3) plating the gold on the surface of the base material after the large wire drawing; 4) performing wire drawing to the base material whose surface is plated with the gold; 5) performing anannealing process to the gold-plated base material after the wire drawing so as to obtain a needed gold bonding wire. In the invention, the high pure silver material is used as a base, the alloy elements are added and the silver material surface is plated with the gold so that costs can be greatly reduced. An electrical conductivity of the bonding alloy wire whose wire diameter is the same with the wire diameter of the traditional gold bonding wire is higher than the electrical conductivity of the traditional gold bonding wire. The bonding alloy wire of the invention is suitable for an integrated circuit, large-scale integrated circuit miniaturization packaging, a discrete device and LED packaging. The production technology of the bonding alloy wire is convenient and practical.

Description

technical field [0001] The invention relates to a bonding alloy wire applicable to integrated circuits and also applicable to discrete devices and LED packaging and its production process, which belongs to the transformation technology of the bonding gold wire and its production process. Background technique [0002] The disadvantages of existing gold-bonded gold wires are high production costs and high prices, which directly affect the economic benefits of production enterprises and directly affect their popularization and application. With the rapid rise of the international situation, the price of gold has risen from 250 yuan / gram in the same period last year to 350 yuan / gram now, and the price has increased by 40%. The price is about 1,000 yuan, and the current price is about 1,400 yuan. In the packaging industry products, gold wires account for about 30% of the entire product. That is to say, the overall product cost has increased by 12%. The price only goes down but n...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/49H01L21/48C22C5/06
CPCH01L2224/43986H01L2224/43125H01L24/45H01L2224/43848H01L24/43H01L2224/45644H01L2224/4321H01L2224/45144C22C5/06H01L2224/45139H01L2224/45565H01L2924/01047H01L2924/00014H01L2924/01006H01L2224/45015H01L2924/14H01L2224/43H01L2224/45H01L2924/00011H01L2924/01203H01L2924/0102H01L2924/01046H01L2924/01079H01L2924/01049H01L2924/01028H01L2924/01029H01L2924/01058H01L2924/01012H01L2924/00H01L2924/013H01L2224/48H01L2924/20108H01L2924/20109H01L2924/2011H01L2924/20752H01L2924/00012H01L2924/01004H01L2924/01005
Inventor 薛子夜周钢赵碎孟
Owner 浙江佳博科技股份有限公司
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