Method for transferring photochemical relief miniature image onto pigment surface
A technology of image transfer and image, which is applied in the direction of photographic plate-making process, optics, and optomechanical equipment on the patterned surface, can solve problems such as inclusions, inability to prepare pigment flakes, and inability to produce pigment flakes, etc., to achieve good results and good optical anti-counterfeiting pattern effect
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Embodiment 1
[0061] The method for transferring the actinic relief miniature image to the surface of the pigment in this embodiment comprises the following steps:
[0062] Provide base material;
[0063] Dilute the photoresist and evenly paint it on the surface of the base material;
[0064] Part of the image on the surface of the photoresist coating is exposed, and the rest is blocked, and then the photoresist coating is exposed;
[0065] Developing and fixing to obtain an actinic micro-relief image;
[0066] Depositing a thin film layer of pigment;
[0067] Pigment film layer peeled off.
[0068] The produced actinic relief miniature image, that is, each image of said image portion has a radial dimension of 1-100 microns, preferably 5-30 microns.
Embodiment 2
[0070] The method for transferring the actinic relief miniature image to the surface of the pigment in this embodiment comprises the following steps:
[0071] Apply diluted photoresist evenly on the surface of the metal substrate;
[0072] Expose the image part on the surface of the photoresist coating, block the non-image part, and then expose the photoresist coating;
[0073] Developed and fixed, obtained as figure 1 Shown is a metal substrate with its surface partially covered by photoresist: the photoresist coating of the image portion 10 is stripped away, exposing the surface of the metal substrate, while the non-image portion 20 is still coated with photoresist. layer coverage;
[0074] The first electroplating thin film on the surface of the metal substrate: as figure 2 As shown, the image portion 10 is covered by the electroplating film layer for the first time, and the non-image portion 20 is still covered by the photoresist coating;
[0075] Paint the diluted p...
Embodiment 3
[0093] Apply diluted photoresist evenly on the surface of the metal substrate;
[0094] Blocking the image part of the photoresist coating surface, exposing the non-image part, and then exposing the photoresist coating;
[0095] Developing and fixing, the image part is still covered by the photoresist coating, and the photoresist coating of the non-image part is peeled off, exposing the surface of the metal substrate;
[0096] Electroplating a film on the surface of the metal substrate: the non-image part is covered by the electroplating film layer, and the image part is still covered by the photoresist coating;
[0097] The photoresist is stripped to obtain a master plate in which the non-image part is raised and the image part is exposed to the metal substrate;
[0098] embossing the mark recording layer with said master, transferring the image information of the master onto the mark recording layer; depositing a pigment thin film layer on the mark recording layer with imag...
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Abstract
Description
Claims
Application Information
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